MAX8523EEE Maxim Integrated Products, MAX8523EEE Datasheet - Page 9

• Manufacturer Part Number: MAX8523EEE
• Description: MOSFET & Power Driver ICs Gate Driver
• Manufacturer: Maxim Integrated Products

Specifications of MAX8523EEE

• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Power dissipation in the IC package comes mainly from
switching the MOSFETs. Therefore, it is a function of
both switching frequency and the total gate charge of
the selected MOSFETs. The total power dissipation
when both drivers are switching is given by:
where f
the total gate charge of the selected high-side
MOSFET, Q
selected low-side MOSFET, N is the total number of the
high-side MOSFETs in parallel, M is the total number of
the low-side MOSFETs in parallel, V
the PV_ pin, R
driver, R
R
MOSFET, R
low-side MOSFETs, V
and I
G_HS
VCC
P
R
R
is the gate resistance of the selected high-side
TOP VIEW
S
IC
HS
LS
LS
is the supply current at the V
is the switching frequency, Q
+
=
+
G_LS
is the on-resistance of the low-side driver,
G_TOTAL_LS
(
(
R
R
R
R
2
PGND1
HS
HS
LS
G HS
G LS
BST1
Applications Information
×
DH1
PV1
DL1
DLY
LX1
V
_
_
is the gate resistance of the selected
CC
is the on-resistance of the high-side
_______________________________________________________________________________________
f
S
1
2
6
3
4
5
7
8
/ )
High-Speed, Dual-Phase Gate Driver for
/ )
VCC
M
×
N
)
(
is the total gate charge of the
N
MAX8523
+
×
is the voltage at the V
QSOP
Pin Configuration
×
M
V
PV
Q
×
Multiphase, Step-Down Converters
Power Dissipation
G TOTAL HS
_
Q
_
+
G TOTAL LS
PV_
16
15
14
13
12
11
10
_
9
V
CC
VCC
is the voltage at
BST2
DH2
LX2
PV2
DL2
PGND2
PWM2
PWM1
G_TOTAL_HS
_
pin.
×
_
×
I
VCC
CC
×
pin,
is
The MAX8523 MOSFET driver sources and sinks large
currents to drive MOSFETs at high switching speeds.
The high di/dt can cause unacceptable ringing if the
trace lengths and impedances are not well controlled.
The following PC board layout guidelines are recom-
mended when designing with the MAX8523:
1) Place all decoupling capacitors (C2, C3, C4, C7) as
2) Minimize the high-current loops from the input capaci-
3) Provide enough copper area at and around the
4) Connect the PGND1 and PGND2 pins of the
5) Keep LX1 and LX2 away from sensitive analog com-
TRANSISTOR COUNT: 1187
PROCESS: BiCMOS
close to their respective pins as possible.
tor, upper-switching MOSFET, and low-side MOSFET
back to the input capacitor negative terminal.
switching MOSFETs and inductors to aid in thermal
dissipation.
MAX8523 as close as possible to the source of the
low-side MOSFETs.
ponents and nodes. Place the IC and analog com-
ponents on the opposite side of the board from the
power-switching node if possible.
PC Board Layout Considerations
Chip Information
9