TJA1050T/VM,518 NXP Semiconductors, TJA1050T/VM,518 Datasheet - Page 13

• Manufacturer Part Number: TJA1050T/VM,518
• Description: IC TRANSCEIVER CAN 8SOIC
• Manufacturer: NXP Semiconductors
• Type: Transceiverr

Specifications of TJA1050T/VM,518

• Number Of Drivers/receivers: 1/1
• Protocol: CAN
• Voltage - Supply: 4.75 V ~ 5.25 V
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935287967518

Philips Semiconductors
BONDING PAD LOCATIONS
Note
1. All x/y coordinates represent the position of the centre
2003 Oct 22
TXD
GND
V
RXD
V
CANL
CANH
S
CC
ref
High speed CAN transceiver
SYMBOL
of each pad (in m) with respect to the lefthand bottom
corner of the top aluminium layer (see Fig.13).
PAD
1
2
3
4
5
6
7
8
1371.5
886.5
538.5
1394
103
740
998
103
COORDINATES
x
1094
1115
1115
1097
103
111
111
(1)
85
y
13
handbook, halfpage
The backside of the bare die must be connected to ground.
x
Fig.13 Bonding pad locations.
0
0
y
8
1
TJA1050U
7
2 3
6
Product specification
MGS381
5
4
TJA1050
test pad