IDTSTAC9753XXTAEB2XR IDT, Integrated Device Technology Inc, IDTSTAC9753XXTAEB2XR Datasheet - Page 90

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IDTSTAC9753XXTAEB2XR

Manufacturer Part Number
IDTSTAC9753XXTAEB2XR
Description
IC CODEC AC'97 MIC/JACK 48-QFP
Manufacturer
IDT, Integrated Device Technology Inc
Type
Audio Codec '97r
Datasheet

Specifications of IDTSTAC9753XXTAEB2XR

Resolution (bits)
20 b
Number Of Adcs / Dacs
2 / 2
Sigma Delta
Yes
Voltage - Supply, Analog
3.14 V ~ 3.47 V; 4.75 V ~ 5.25 V
Voltage - Supply, Digital
3.14 V ~ 3.47 V
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
48-QFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
STAC9753XXTAEB2XR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IDTSTAC9753XXTAEB2XR
Manufacturer:
IDT, Integrated Device Technology Inc
Quantity:
10 000
15. SOLDER REFLOW PROFILE
IDT™
TWO-CHANNEL, 20-BIT, AC’97 2.3 CODECS WITH HEADPHONE DRIVE, SPDIF OUTPUT MICROPHONE & JACK SENSING
STAC9752/9753
TWO-CHANNEL, 20-BIT, AC’97 2.3 CODECS WITH HEADPHONE DRIVE, SPDIF OUTPUT MICROPHONE & JACK SENSING
15.1. Standard Reflow Profile Data
Time maintained above
Time within 5
Note: All temperatures refer to topside of the package, measured on the package body surface.
Preheat
Peak / Classification Temperature (Tp)
Profile Feature
Average Ramp-Up Rate (Ts
Note: These devices can be hand soldered at 360
FROM: IPC / JEDEC J-STD-020C “Moisture/Reflow Sensitivity Classification for Nonhermetic Solid
State Surface Mount Devices” (www.jedec.org/download).
o
C of actual Peak Temperature (tp)
Time 25
Temperature Max (Ts
Temperature Min (Ts
o
C to Peak Temperature
Time (ts
Temperature (T
Ramp-Down rate
min
max
Time (t
- ts
Figure 25. Reflow Profile
- Tp)
max
max
min
L
L
)
)
)
)
)
3
150
200
60 - 180 seconds
217
60 - 150 seconds
See “Package Classification Reflow Temperatures” on page 91.
20 - 40 seconds
6
8 minutes max
o
o
C / second max
C / second max
90
o
o
o
C
C
C
o
C for 3 to 5 seconds.
Pb Free Assembly
STAC9752/9753
REV 3.3 1206

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