MPC8255ACZUMHBB Freescale Semiconductor, MPC8255ACZUMHBB Datasheet - Page 37
MPC8255ACZUMHBB
Manufacturer Part Number
MPC8255ACZUMHBB
Description
IC MPU POWERQUICC II 480-TBGA
Manufacturer
Freescale Semiconductor
Specifications of MPC8255ACZUMHBB
Processor Type
MPC82xx PowerQUICC II 32-bit
Speed
266MHz
Voltage
2V
Mounting Type
Surface Mount
Package / Case
480-TBGA
Family Name
MPC82XX
Device Core
PowerQUICC II
Device Core Size
32b
Frequency (max)
266MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
2V
Operating Supply Voltage (max)
2.1V
Operating Supply Voltage (min)
1.9V
Operating Temp Range
-40C to 105C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
480
Package Type
TBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-
Lead Free Status / Rohs Status
Not Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MPC8255ACZUMHBB
Manufacturer:
MOTOROLA
Quantity:
745
Company:
Part Number:
MPC8255ACZUMHBB
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MPC8255ACZUMHBB
Manufacturer:
FREESCALE
Quantity:
20 000
5
The following sections provide the package parameters and mechanical dimensions for the MPC8260.
5.1
Package parameters are provided in
Freescale Semiconductor
UTS
UT8
UT16
MII
Package Description
MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 2
Package Parameters
Symbol
Package Outline
Interconnects
Pitch
Nominal unmounted package height 1.55 mm
Table 15. Symbol Legend (continued)
Parameter
Table
Table 16. Package Parameters
16. The package type is a 37.5 × 37.5 mm, 480-lead TBGA.
Indicates that a signal is part of the UTOPIA slave interface
Indicates that a signal is part of the 8-bit UTOPIA interface
Indicates that a signal is part of the 16-bit UTOPIA interface
Indicates that a signal is part of the media independent interface
37.5 x 37.5 mm
480 (29 x 29 ball array)
1.27 mm
Value
Meaning
Package Description
37