IDT79RV4640-200DU IDT, Integrated Device Technology Inc, IDT79RV4640-200DU Datasheet - Page 8

• Manufacturer Part Number: IDT79RV4640-200DU
• Description: IC SGL BOARD COMPUTER 128-QFP
• Manufacturer: IDT, Integrated Device Technology Inc

Specifications of IDT79RV4640-200DU

• Processor Type: RISC 64-Bit
• Speed: 200MHz
• Voltage: 3.3V
• Mounting Type: Surface Mount
• Package / Case: 128-QFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -
• Other names: 79RV4640-200DU

If the conditions are not correct when the WAIT instruction finishes the
W pipe-stage (i.e. the SysAd bus is not idle), the WAIT is treated as a
NOP.
nally generated timer interrupt, will cause the CPU to exit Standby
Mode.
Thermal Considerations
thermal properties of high-speed processors. The RV4640 is packaged
using cavity-up packaging in a 128-pin thermally enhanced PQFP
package (“DU”) with a drop-in heat spreader, for devices with low peak
power. The R4640 utilizes the PQFP package for higher power
consumption devices (the “DZ” package), which is an all-aluminum
package with the die attached to a normal copper lead frame mounted to
the aluminum casing.
package allows for an efficient thermal transfer between the die and the
case. The aluminum offers less internal resistance from one end of the
package to the other, reducing the temperature gradient across the
package and therefore presenting a greater area for convection and
conduction to the PCB for a given temperature. Even nominal amounts
of air flow will dramatically reduce the junction temperature of the die,
resulting in cooler operation. The PQFP package is pin and socket
compatible with the 128-pin QFP package.
range of 0°C to +85°C for commercial temperature parts and the
RV4640 in a case temperature range of -40°C to +85°C for industrial
IDT79RC4640™
Once the CPU is in Standby Mode, any interrupt, including the inter-
The RC4640 utilizes special packaging techniques to improve the
Due to the heat-spreading effect of the aluminum, the PQFP
The R4640
SysCmd
ValidOut
MasterClock
SysAD
ValidIn
RdRdy
WrRdy
Release
and the RV4640
are guaranteed in a case temperature
Read
Addr
Figure 3 RC4640 Block Read Request
8 of 23
Data0
CData
temperature parts. The type of package, speed (power) of the device,
and air flow conditions affect the equivalent ambient temperature condi-
tions that will meet this specification.
using the thermal resistance from case to ambient (∅
package. The following equation relates ambient and case tempera-
tures:
calculated by using the maximum I
Typical values for ∅
substantially reduce the average power dissipation of the device. This
operation is described in the IDT79RC4640/ IDT79RC4650 RISC
Processor Hardware User’s Manual.
Airflow (ft/min)
128 PQFP (DU)
128 PQFP (DZ)
CData
Data1
The equivalent allowable ambient temperature, T
T
where P is the maximum power consumption at hot temperature,
Note that the RC4640 implements advanced power management to
A
= T
Table 5 Thermal Resistance (∅CA) at Various Airflows
C
- P * ∅
CA
CA
17
20
at various air flows are shown in Table 5.
0
12
9
CData
200
Data6
7
9.5
400
CEOD
Data7
CC
specification for the device.
∅
5
8
CA
600
December 5, 2008
A
4
7
, can be calculated
800
CA
) of the given
3
6.5
1000