MPC8541EVTAJD Freescale Semiconductor, MPC8541EVTAJD Datasheet - Page 74

IC MPU POWERQUICC III 783-FCPBGA

MPC8541EVTAJD

Manufacturer Part Number
MPC8541EVTAJD
Description
IC MPU POWERQUICC III 783-FCPBGA
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MPC8541EVTAJD

Processor Type
MPC85xx PowerQUICC III 32-Bit
Speed
533MHz
Voltage
1.2V
Mounting Type
Surface Mount
Package / Case
783-FCPBGA
For Use With
MPC8548CDS - DEV TOOLS CDS FOR 8548CWH-PPC-8540N-VE - KIT EVAL SYSTEM MPC8540
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-

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Thermal
The spring mounting should be designed to apply the force only directly above the die. By localizing the
force, rocking of the heat sink is minimized. One suggested mounting method attaches a plastic fence to
the board to provide the structure on which the heat sink spring clips. The plastic fence also provides the
opportunity to minimize the holes in the printed-circuit board and to locate them at the corners of the
package.
Figure 47
and provide exploded views of the plastic fence, heat sink, and spring clip.
Figure 47. Exploded Views (1) of a Heat Sink Attachment using a Plastic Fence
MPC8541E PowerQUICC™ III Integrated Communications Processor Hardware Specification, Rev. 4.2
74
Freescale Semiconductor

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