RPIXP2850BB Intel, RPIXP2850BB Datasheet - Page 95

• Manufacturer Part Number: RPIXP2850BB
• Manufacturer: Intel

Specifications of RPIXP2850BB

• Operating Supply Voltage (typ): 1.3/1.5/2.5/3.3V
• Operating Supply Voltage (max): 1.575/2.7/3.465V
• Operating Supply Voltage (min): 1.235/2.3/3.135V
• Mounting: Surface Mount
• Operating Temperature (max): 70C
• Operating Temperature (min): 0C
• Operating Temperature Classification: Commercial
• Lead Free Status / Rohs Status: Not Compliant

IXP28XX Network Processor
QDR SRAM
4.12
Package Trace Lengths for QDR Signals
Table 35
provides package trace lengths for QDR signals, listed by decreasing lengths in a given
logical grouping. Signals in boldface type within the table indicate the start of a logical grouping.
The flight time on the package substrate is 154ps/in which differs from the flight delay of standard
FR4, typical 180ps/in. As a result the package routing lengths in
Table 35
must be adjusted to
compensate for the difference in flight delay between the package and the PCB. For example
QDR0_Q_H[16] has a package length of 0.628 in, and the target PCB has a flight delay of
180ps/in. In order to adjust the package length to match the PCB flight delay this length must be
multiplied by the ratio of 154/180 or the difference between the package and PCB flight delays.
Therefore the trace package routing length that must be accounted for on the PCB is
0.628*(154/180) or 0.537 in.
Note: If the flight delay of the target PCB is not 180 ps/in then the ratio, (154/180), must be modified
accordingly, i.e., the denominator would be changed to reflect the actual flight delay.
Hardware Design Guide
95