TFDU4202-TR1 Vishay, TFDU4202-TR1 Datasheet - Page 6

• Manufacturer Part Number: TFDU4202-TR1
• Manufacturer: Vishay
• Type: TX/RXr

Specifications of TFDU4202-TR1

• Data Rate: 115.2Kbps
• Peak Wavelength: 900nm
• Pulse Width: 20us
• Package Type: SMD
• Fall Time: 200/70ns
• Rise Time: 200/70ns
• Dimensions: 7.1x4.7x2.8
• Operating Supply Voltage (typ): 2.5/3.3/5V
• Operating Supply Voltage (min): 2.4V
• Operating Supply Voltage (max): 5.5V
• Mounting: Surface Mount
• Pin Count: 8
• Operating Temp Range: -25C to 85C
• Operating Temperature Classification: Commercial
• Lead Free Status / Rohs Status: Compliant

TFDU4202
Vishay Semiconductors
Recommended Solder Profiles
Solder Profile for Sn/Pb Soldering
Lead (Pb)-Free, Recommended Solder Profile
The TFDU4202 is a lead (Pb)-free transceiver and
qualified for lead (Pb)-free processing. For lead (Pb)-
free solder paste like Sn (3.0 - 4.0) Ag (0.5 - 0.9) Cu,
there are two standard reflow profiles: Ramp-Soak-
Spike (RSS) and Ramp-To-Spike (RTS). The Ramp-
Soak-Spike profile was developed primarily for reflow
ovens heated by infrared radiation. With widespread
use of forced convection reflow ovens the Ramp-To-
Spike profile is used increasingly. Shown below in fig-
ure 3 and 4 are VISHAY's recommended profiles for
use with the TFDU4202 transceivers. For more
details please refer to the application note
“SMD Assembly Instructions”
(http://www.vishay.com/docs/82602/82602.pdf).
A ramp-up rate less than 0.9 °C/s is not recom-
mended. Ramp-up rates faster than 1.3 °C/s could
damage an optical part because the thermal conduc-
tivity is less than compared to a standard IC.
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices
wave soldering is not recommended.
Manual Soldering
Manual soldering is the standard method for lab use.
However, for a production process it cannot be rec-
ommended because the risk of damage is highly
dependent on the experience of the operator. Never-
theless, we added a chapter to the above mentioned
application note, describing manual soldering and
desoldering.
www.vishay.com
6
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Figure 2. Recommended Solder Profile for Sn/Pb soldering
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
2...4 °C/s
50
100
160 °C max.
120 s...180 s
240 °C max.
150
Time/s
200
2...4 °C/s
10 s max. at 230 °C
90 s max.
250
300
350
Storage
The storage and drying processes for all VISHAY
transceivers (TFDUxxxx and TFBSxxx) are equiva-
lent to MSL4.
The data for the drying procedure is given on labels
on the packing and also in the application note
"Taping, Labeling, Storage and Packing"
(http://www.vishay.com/docs/82601/82601.pdf).
19532
275
250
225
200
175
150
125
100
280
260
240
220
200
180
160
140
120
100
75
50
25
80
60
40
20
0
0
0
0
Figure 3. Solder Profile, RSS Recommendation
2 °C...3 °C/s
50
T ≥ 217 °C for 70 s max
50
Figure 4. RTS Recommendation
T ≥ 255 °C for 10 s....30 s
100
1.3 °C/s
100
90 s...120 s
T
peak
Time above 217 °C t ≤ 70 s
Time above 250 °C t ≤ 40 s
Peak temperature T
= 260 °C max
150
Time/s
Time/s
150
200
peak
Document Number 82541
= 260 °C
30 s max.
70 s max.
200
< 4 °C/s
250
Rev. 2.0, 06-Oct-06
T peak = 260 °C
< 2 °C/s
2 °C...4 °C/s
250
300
350
300