DAC8143FS Analog Devices Inc, DAC8143FS Datasheet - Page 4

• Manufacturer Part Number: DAC8143FS
• Description: IC DAC 12BIT DAISY-CHAIN 16-SOIC
• Manufacturer: Analog Devices Inc

Specifications of DAC8143FS

• Rohs Status: RoHS non-compliant
• Settling Time: 380ns
• Number Of Bits: 12
• Data Interface: Serial
• Number Of Converters: 1
• Voltage Supply Source: Single Supply
• Power Dissipation (max): 500µW
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.300", 7.5mm Width)

ABSOLUTE MAXIMUM RATINGS
(T
V
V
V
AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . . V
DGND to AGND . . . . . . . . . . . . . . . . . . . . . . . . V
Digital Input Voltage Range . . . . . . . . . . . . . . . –0.3 V to V
Output Voltage (Pin 1, Pin 2) . . . . . . . . . . . . . . –0.3 V to V
Operating Temperature Range
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150 C
Storage Temperature . . . . . . . . . . . . . . . . . . –65 C to +150 C
Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . +300 C
Package Type
16-Lead Plastic DIP
16-Lead SOIC
*
CAUTION
1. Do not apply voltage higher than V
2. The digital control inputs are Zener-protected; however,
3. Use proper antistatic handling procedures.
4. Absolute Maximum Ratings apply to packaged devices.
DAC8143
Model
DAC8143FP
DAC8143FS
Die Size: 99
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the DAC8143 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
device in socket for P-DIP package;
printed circuit board for SOIC package.
DD
REF
RFB
JA
A
FP/FS Versions . . . . . . . . . . . . . . . . . . . . . –40 C to +85 C
tential on any terminal except V
permanent damage may occur on unprotected units from
high energy electrostatic fields. Keep units in conductive
foam at all times until ready to use.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device.
= +25 C, unless otherwise noted.)
is specified for worst case mounting conditions, i.e.,
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +17 V
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 V
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 V
107 mil, 10,543 sq. mils.
Nonlinearity
1 LSB
1 LSB
JA
is specified for device soldered to
76
92
REF
JA
*
DD
(Pin 15) and R
or less than DGND po-
33
27
Gain
Error
JC
JA
2 LSB
2 LSB
is specified for
FB
DD
DD
(Pin 16).
Units
+ 0.3 V
+ 0.3 V
ORDERING GUIDE
C/W
C/W
DD
DD
–4–
Temperature
Range
–40 C to +85 C
–40 C to +85 C
16-Lead Epoxy Plastic DIP
AGND
I
I
STB
STB
OUT1
OUT2
SRO
PIN CONNECTIONS
LD
SRI
Package
Descriptions
16-Lead Plastic DIP
16-Lead SOIC
1
1
2
16-Lead SOIC
1
2
3
4
5
6
7
8
(Not to Scale)
DAC8143
TOP VIEW
WARNING!
16
15
14
13
12
11
10
9
R
V
V
CLR
DGND
STB
STB
LD
REF
DD
FB
2
4
3
ESD SENSITIVE DEVICE
Package
Options
N-16
R-16W
REV. C