PCF8591T/2,518 NXP Semiconductors, PCF8591T/2,518 Datasheet - Page 2

IC ADC/DAC 8-BIT I2C 16-SOIC

PCF8591T/2,518

Manufacturer Part Number
PCF8591T/2,518
Description
IC ADC/DAC 8-BIT I2C 16-SOIC
Manufacturer
NXP Semiconductors
Type
ADC, DACr
Datasheet

Specifications of PCF8591T/2,518

Package / Case
16-SOIC (0.300", 7.5mm Width)
Resolution (bits)
8 b
Sampling Rate (per Second)
11.1k
Data Interface
I²C, Serial
Voltage Supply Source
Dual ±
Voltage - Supply
2.5 V ~ 6 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
568-1088-2
935276541518
PCF8591TD-T

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PCF8591T/2,518
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Philips Semiconductors
CONTENTS
1
2
3
4
5
6
7
7.1
7.2
7.3
7.4
7.5
7.6
8
8.1
8.2
8.3
8.4
8.5
9
10
11
12
13
14
15
16
17
17.1
17.2
17.3
17.4
18
19
20
21
2003 Jan 27
8-bit A/D and D/A converter
FEATURES
APPLICATIONS
GENERAL DESCRIPTION
ORDERING INFORMATION
BLOCK DIAGRAM
PINNING
FUNCTIONAL DESCRIPTION
Addressing
Control byte
D/A conversion
A/D conversion
Reference voltage
Oscillator
CHARACTERISTICS OF THE I
Bit transfer
Start and stop conditions
System configuration
Acknowledge
I
LIMITING VALUES
HANDLING
DC CHARACTERISTICS
D/A CHARACTERISTICS
A/D CHARACTERISTICS
AC CHARACTERISTICS
APPLICATION INFORMATION
PACKAGE OUTLINES
SOLDERING
Introduction to soldering through-hole mount
packages
Soldering by dipping or by solder wave
Manual soldering
Suitability of through-hole mount IC packages
for dipping and wave soldering methods
DATA SHEET STATUS
DEFINITIONS
DISCLAIMERS
PURCHASE OF PHILIPS I
2
C-bus protocol
2
C COMPONENTS
2
C-BUS
2
Product specification
PCF8591

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