AD7730LBRU Analog Devices Inc, AD7730LBRU Datasheet - Page 5

IC ADC TRANSDUCER BRIDGE 24TSSOP

AD7730LBRU

Manufacturer Part Number
AD7730LBRU
Description
IC ADC TRANSDUCER BRIDGE 24TSSOP
Manufacturer
Analog Devices Inc
Datasheet

Specifications of AD7730LBRU

Rohs Status
RoHS non-compliant
Number Of Bits
24
Sampling Rate (per Second)
600
Data Interface
DSP, Serial, SPI™
Number Of Converters
1
Power Dissipation (max)
125mW
Voltage Supply Source
Analog and Digital
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
24-TSSOP (0.173", 4.40mm Width)
For Use With
EVAL-AD7730LEBZ - BOARD EVALUATION FOR AD7730EVAL-AD7730EBZ - BOARD EVAL FOR AD7730

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ABSOLUTE MAXIMUM RATINGS*
(T
AV
AV
DV
DV
AGND to DGND . . . . . . . . . . . . . . . . . . . . . . –5 V to +0.3 V
AV
Analog Input Voltage to AGND . . . . –0.3 V to AV
Reference Input Voltage to AGND . . –0.3 V to AV
AIN/REF IN Current (Indefinite) . . . . . . . . . . . . . . . . 30 mA
Digital Input Voltage to DGND . . . . –0.3 V to DV
Digital Output Voltage to DGND . . . –0.3 V to DV
Output Voltage (ACX, ACX, D0, D1) to DGND
Operating Temperature Range
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . +150 C
REV. A
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD7730 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
A
Industrial (B Version) . . . . . . . . . . . . . . . –40 C to +85 C
Storage Temperature Range . . . . . . . . . . . –65 C to +150 C
DD
DD
DD
. . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to AV
DD
DD
= +25 C unless otherwise noted)
to AGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
to DGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
to DV
to AGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
to DGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
DD
. . . . . . . . . . . . . . . . . . . . . . . . . –2 V to +5 V
Model
AD7730BN
AD7730BR
AD7730BRU
EVAL-AD7730EB
AD7730LBR
AD7730LBRU
EVAL-AD7730LEB
Figure 1. Load Circuit for Access Time and Bus Relinquish Time
TO OUTPUT
PIN
–40 C to +85 C
–40 C to +85 C
Evaluation Board
Evaluation Board
Temperature
Range
–40 C to +85 C
–40 C to +85 C
–40 C to +85 C
50pF
DD
DD
DD
DD
DD
+ 0.3 V
+ 0.3 V
+ 0.3 V
+ 0.3 V
+ 0.3 V
ORDERING GUIDE
–5–
Plastic DIP Package, Power Dissipation . . . . . . . 450 mW
TSSOP Package, Power Dissipation . . . . . . . . . . 450 mW
SOIC Package, Power Dissipation . . . . . . . . . . . . 450 mW
*Stresses above those listed under Absolute Maximum Ratings may cause
I
I
SINK
SOURCE
permanent damage to the device. This is a stress rating only; functional
operation of the device at these or any other conditions above those listed in
the operational sections of this specification is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device
reliability.
Package
Description
Plastic DIP
Small Outline
Thin Shrink Small Outline
Small Outline
Thin Shrink Small Outline
Lead Temperature (Soldering, 10 sec) . . . . . . . +260 C
Lead Temperature, Soldering
Lead Temperature, Soldering
JA
JA
JA
(800 A AT DV
100 A AT DV
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . +215 C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . +220 C
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . +215 C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . +220 C
Thermal Impedance . . . . . . . . . . . . . . . . . 105 C/W
Thermal Impedance . . . . . . . . . . . . . . . . . 128 C/W
Thermal Impedance . . . . . . . . . . . . . . . . . . 75 C/W
(200 A AT DV
100 A AT DV
+1.6V
DD
DD
= +5V
= +3V)
DD
DD
= +5V
= +3V)
AD7730/AD7730L
Package
Options
N-24
R-24
RU-24
R-24
RU-24
WARNING!
ESD SENSITIVE DEVICE

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