MCP3301-BI/SN Microchip Technology, MCP3301-BI/SN Datasheet - Page 24

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MCP3301-BI/SN

Manufacturer Part Number
MCP3301-BI/SN
Description
IC ADC 13BIT 2.7V SPI 8-SOIC
Manufacturer
Microchip Technology
Datasheet

Specifications of MCP3301-BI/SN

Package / Case
8-SOIC (0.154", 3.90mm Width)
Number Of Bits
13
Sampling Rate (per Second)
100k
Data Interface
Serial, SPI™
Number Of Converters
1
Voltage Supply Source
Single Supply
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Architecture
SAR
Conversion Rate
100 KSPs
Resolution
12 bit
Input Type
Voltage
Snr
80.02 dB
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Input Signal Type
Pseudo-Differential, Differential
Minimum Operating Temperature
- 40 C
Resolution (bits)
13bit
Sampling Rate
100kSPS
Input Channel Type
Differential
Supply Voltage Range - Analogue
2.7V To 5.5V
Supply Current
300µA
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
TMPSNS-RTD1 - BOARD EVAL PT100 RTD TEMP SENSOR
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCP3301-BI/SN
Manufacturer:
AD
Quantity:
15 600
Part Number:
MCP3301-BI/SN
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
MCP3301
8-Lead Plastic Micro Small Outline Package (MS) [MSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
DS21700C-page 24
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A
A1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
1
N
b
2
D
e
E1
A2
Dimension Limits
E
c
Units
A2
A1
E1
L1
N
A
E
D
e
L
φ
c
b
0.75
0.00
0.40
0.08
0.22
MIN
L1
MILLIMETERS
0.65 BSC
4.90 BSC
3.00 BSC
3.00 BSC
0.95 REF
NOM
0.60
0.85
8
Microchip Technology Drawing C04-111B
© 2007 Microchip Technology Inc.
MAX
1.10
0.95
0.15
0.80
0.23
0.40
L
φ

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