DS1643-85+ Maxim Integrated Products, DS1643-85+ Datasheet - Page 12

• Manufacturer Part Number: DS1643-85+
• Description: IC RAM TIMEKEEP NV 85NS 28-EDIP
• Manufacturer: Maxim Integrated Products
• Type: Clock/Calendar/NVSRAMr

Specifications of DS1643-85+

• Memory Size: 64K (8K x 8)
• Time Format: HH:MM:SS (24 hr)
• Date Format: YY-MM-DD-dd
• Interface: Parallel
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Through Hole
• Package / Case: 28-DIP Module (600 mil), 28-EDIP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

AC TEST CONDITIONS
Output Load: 100pF + 1TTL Gate
Input Pulse Levels: 0 to 3.0V
Timing Measurement Reference Levels:
Input Pulse Rise and Fall Times: 5ns
NOTES:
1) Voltages are referenced to ground.
2) Typical values are at +25C and nominal supplies.
3) Outputs are open.
4) The CE2 control signal functions exactly the same as the
5) Data retention time is at 25C.
6) Each DS1643 has a built-in switch that disconnects the lithium source until V
7) Real-Time Clock Modules (DIP) can be successfully processed through conventional wave-soldering
PACKAGE INFORMATION
For the latest package outline information and land patterns, go to www.maxim-ic.com/packages. Note
that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a
different suffix character, but the drawing pertains to the package regardless of RoHS status.
active and inactive levels are opposite.
user. The expected t
from the time power is first applied by the user.
techniques as long as temperature exposure to the lithium energy source contained within does not
exceed +85C. Post-solder cleaning with water washing techniques is acceptable, provided that
ultrasonic vibration is not used.
In addition, for the PowerCap:
PACKAGE TYPE
Input: 1.5V
Output: 1.5V
a. Dallas Semiconductor recommends that PowerCap Module bases experience one pass through
b. Hand soldering and touch-up: Do not touch or apply the soldering iron to leads for more than
34 PowerCap
solder reflow oriented with the label side up (“live-bug”).
3 seconds. To solder, apply flux to the pad, heat the lead frame pad and apply solder. To
remove the part, apply flux, heat the lead frame pad until the solder reflow and use a solder
wick to remove solder.
28 EDIP
DR
is defined for DIP modules as a cumulative time in the absence of V
PACKAGE CODE
MDF28+2
PC1+2
12 of 17
CE
signal except that the logic levels for
DOCUMENT NO.
CC
21-0245
21-0246
is first applied by the
DS1643/DS1643P
CC
starting