DS12CR887-5+ Maxim Integrated Products, DS12CR887-5+ Datasheet - Page 21

• Manufacturer Part Number: DS12CR887-5+
• Description: IC RTC W/RAM 128 BYTE 24-EDIP
• Manufacturer: Maxim Integrated Products
• Type: Clock/Calendar/NVSRAMr

Specifications of DS12CR887-5+

• Memory Size: 114B
• Time Format: HH:MM:SS (12/24 hr)
• Date Format: YY-MM-DD-dd
• Interface: Parallel
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Through Hole
• Package / Case: 24-DIP (600 mil) Module
• Function: Clock/Calendar
• Rtc Memory Size: 114 Byte
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 4.5 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: Through Hole
• Rtc Bus Interface: Multiplexed
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

The EDIP and BGA packages contain a quartz tuning-
fork crystal. Pick-and-place equipment can be used,
but precautions should be taken to ensure that exces-
sive shocks are avoided. Ultrasonic cleaning should be
avoided to prevent damage to the crystal.
The BGA package can be reflowed as long as the fol-
lowing conditions are met:
1. Preheating (below 160°C) is within 90 seconds.
2. Maximum time above 150°C is less than 180 seconds.
3. Maximum time above 170°C is less than 100 seconds.
4. Maximum time above 200°C is less than 60 seconds.
TOP VIEW
RTCs with Constant-Voltage Trickle Charger
Handling, PC Board Layout,
MOT
GND
AD0
AD1
AD2
AD3
AD4
AD5
AD6
AD7
X1
X2
10
11
12
1
2
3
4
5
6
7
8
9
SO (0.300")
DS12R885
and Assembly
____________________________________________________________________
24
23
22
21
20
19
18
17
16
15
14
13
V
SQW
N.C.
RCLR
V
IRQ
RESET
DS
GND
R/W
AS
CS
CC
BACKUP
Exposure to reflow is limited to two times maximum.
Moisture-sensitive packages are shipped from the
factory dry-packed. Handling instructions listed on the
package label must be followed to prevent damage dur-
ing reflow. Refer to the IPC/JEDEC J-STD-020B standard
for Moisture-Sensitive Device (MSD) classifications.
The EDIP (DS12CR887) module can be successfully
processed through conventional wave-soldering tech-
niques so long as temperature exposure to the lithium
energy source does not exceed +85°C. Post-solder
cleaning with water-washing techniques is acceptable,
provided that ultrasonic vibration is not used. Such
cleaning can damage the crystal.
5. Maximum time above 220°C is less than 30 seconds.
6. Peak temperature is less than or equal to 230°C.
MOT
GND
N.C.
N.C.
AD0
AD1
AD2
AD3
AD4
AD5
AD6
AD7
10
11
12
1
2
3
4
5
6
7
8
9
EDIP (0.700")
DS12CR887
Pin Configurations
24
23
22
21
20
19
18
17
16
15
14
13
V
SQW
N.C.
N.C.
N.C.
IRQ
RESET
DS
N.C.
R/W
AS
CS
CC
21