ISL1218IBZ Intersil, ISL1218IBZ Datasheet - Page 3

• Manufacturer Part Number: ISL1218IBZ
• Description: IC RTC LP BATT BACKED SRAM 8SOIC
• Manufacturer: Intersil
• Type: Clock/Calendar/NVSRAMr

Specifications of ISL1218IBZ

• Memory Size: 8B
• Time Format: HH:MM:SS (12/24 hr)
• Date Format: YY-MM-DD-dd
• Interface: I²C, 2-Wire Serial
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Absolute Maximum Ratings
Voltage on V
Voltage on X1 and X2 Pins
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Lead Temperature (Soldering, 10s) . . . . . . . . . . . . . . . . . . . . . 300°C
ESD Rating (Human Body Model) . . . . . . . . . . . . . . . . . . . . . . .>2kV
ESD Rating (Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . .>175V
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
DC Operating Characteristics – RTC
Power-Down Timing
Serial Interface Specifications
SERIAL INTERFACE SPECS
V
V
V
V
I
I
I
I
I
I
I
V
V
V
IRQ/F
V
I
V
1. θ
DD1
DD2
DD3
BAT
BATLKG
LI
LO
LO
(respect to ground) . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7.0V
(respect to ground) . . . . . . . . . . . .-0.5V to V
IL
IH
DD
BAT
TRIP
TRIPHYS
BATHYS
OL
DD SR-
SYMBOL
SYMBOL
SYMBOL
JA
OUT
is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
DD
, V
SDA and SCL Input Buffer LOW
Voltage
SDA and SCL Input Buffer HIGH
Voltage
BAT
Main Power Supply
Battery Supply Voltage
Supply Current
Supply Current With I
Supply Current (Low Power Mode)
Battery Supply Current
Battery Input Leakage
Input Leakage Current on SCL
I/O Leakage Current on SDA
V
V
V
Output Low Voltage
Output Leakage Current
V
BAT
TRIP
BAT
DD
, SCL, SDA, and IRQ/F
Negative Slewrate
Mode Threshold
Hysteresis
Hysteresis
PARAMETER
Temperature = -40°C to +85°C, unless otherwise stated.
PARAMETER
PARAMETER
3
-0.5V to V
2
C Active
Over the recommended operating conditions unless otherwise specified.
BAT
OUT
DD
+ 0.5 (V
+ 0.5 (V
Temperature = -40°C to +85°C, unless otherwise stated.
Pins
BAT
DD
V
V
V
V
V
V
V
V
V
V
DD
DD
DD
DD
BAT
DD
DD
DD
DD
OUT
Mode)
Mode)
= 5V
= 3V
= 5V
= 5V, LPMODE = 1
= 5.5V, V
= 5V, I
= 2.7V, I
= 5.5V
TEST CONDITIONS
= 3V
= 5.5V
ISL1218
CONDITIONS
CONDITIONS
OL
OL
BAT
= 3mA
= 1mA
Thermal Information
Thermal Resistance (Typical, Note 1)
Moisture Sensitivity for MSOP Package
Moisture Sensitivity for SOIC Package
Maximum Junction Temperature (Plastic Package). . . . . . . . . 150°C
= 1.8V
8 Ld MSOP Package . . . . . . . . . . . . . . . . . . . . . . . .
8 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . .
(see Technical Brief TB363). . . . . . . . . . . . . . . . . . . . . . . . Level 2
(see Technical Brief TB363). . . . . . . . . . . . . . . . . . . . . . . . Level 1
MIN
MIN
2.7
1.8
1.6
10
10
0.7 x
V
MIN
-0.3
DD
(Note 5)
(Note 5)
TYP
TYP
400
100
100
100
1.2
1.4
2.2
40
35
50
2
(Note 5)
TYP
MAX
MAX
2.64
120
950
100
100
400
5.5
5.5
0.4
0.4
60
10
6
4
5
V
MAX
0.3 x
V
DD
0.3
DD
+
UNITS
UNITS
V/ms
mV
mV
µA
µA
µA
µA
nA
nA
nA
nA
nA
V
V
V
V
V
UNITS
V
V
June 22, 2006
θ
NOTES
NOTES
JA
NOTES
2, 3
2, 3
2, 7
130
110
FN6313.0
2
4
(°C/W)