CDP68HC68T1EZ Intersil, CDP68HC68T1EZ Datasheet - Page 23

IC RTC 32X8 NVSRAM CMOS 16DIP

CDP68HC68T1EZ

Manufacturer Part Number
CDP68HC68T1EZ
Description
IC RTC 32X8 NVSRAM CMOS 16DIP
Manufacturer
Intersil
Type
Clock/Calendar/NVSRAMr
Datasheet

Specifications of CDP68HC68T1EZ

Memory Size
32B
Time Format
HH:MM:SS (12/24 hr)
Date Format
YY-MM-DD-dd
Interface
SPI, 3-Wire Serial
Voltage - Supply
3 V ~ 6 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Through Hole
Package / Case
16-DIP (0.300", 7.62mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CDP68HC68T1EZ
Manufacturer:
MICROCHIP
Quantity:
4 500
Part Number:
CDP68HC68T1EZ
Manufacturer:
Intersil
Quantity:
1 711
Part Number:
CDP68HC68T1EZ
Manufacturer:
TexasInstruments
Quantity:
105
Small Outline Plastic Packages (SOIC)
NOTES:
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
10. Controlling dimension: MILLIMETER. Converted inch
N
1. Symbols are defined in the “MO Series Symbol List” in Section
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
4. Dimension “E” does not include interlead flash or protrusions.
5. The chamfer on the body is optional. If it is not present, a visual
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
1
2.2 of Publication Number 95.
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
Interlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
index feature must be located within the crosshatched area.
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
dimensions are not necessarily exact.
0.25(0.010)
2
-A-
INDEX
AREA
3
e
B
D
M
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
C A
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
SEATING PLANE
M
For information regarding Intersil Corporation and its products, see www.intersil.com
-C-
E
-B-
B S
A
23
H
A1
α
0.10(0.004)
0.25(0.010)
M
L
h x 45°
B
M
CDP68HC68T1
C
M20.3
20 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
A1
A
B
C
D
E
H
N
α
e
h
L
(JEDEC MS-013-AC ISSUE C)
0.0926
0.0040
0.014
0.0091
0.4961
0.2914
0.394
0.010
0.016
MIN
0.050 BSC
INCHES
20
0.1043
0.0118
0.019
0.0125
0.5118
0.2992
0.419
0.029
0.050
MAX
12.60
10.00
2.35
0.10
0.35
0.23
7.40
0.25
0.40
MIN
MILLIMETERS
1.27 BSC
20
13.00
10.65
2.65
0.30
0.49
0.32
7.60
0.75
1.27
MAX
October 29, 2007
Rev. 2 6/05
NOTES
FN1547.8
9
3
4
5
6
7
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-
-
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