ADF4106BCP-REEL7 Analog Devices Inc, ADF4106BCP-REEL7 Datasheet - Page 21

• Manufacturer Part Number: ADF4106BCP-REEL7
• Description: IC PLL FREQ SYNTHESIZER 20-LFCSP
• Manufacturer: Analog Devices Inc
• Type: Clock/Frequency Synthesizer (RF)r

Specifications of ADF4106BCP-REEL7

• Rohs Status: RoHS non-compliant
• Pll: Yes
• Input: CMOS
• Output: Clock
• Number Of Circuits: 1
• Ratio - Input:output: 2:1
• Differential - Input:output: Yes/No
• Frequency - Max: 6GHz
• Divider/multiplier: No/No
• Voltage - Supply: 2.7 V ~ 3.3 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 20-LFCSP
• Frequency-max: 6GHz
• For Use With: EVAL-ADF4106EBZ1 - BOARD EVAL FOR ADF4106

ORDERING GUIDE
Model
ADF4106BRU
ADF4106BRU-REEL
ADF4106BRU-REEL7
ADF4106BRUZ
ADF4106BRUZ-RL
ADF4106BRUZ-R7
ADF4106BCP
ADF4106BCP-REEL
ADF4106BCP-REEL7
ADF4106BCPZ
ADF4106BCPZ-RL
ADF4106BCPZ-R7
EVAL-ADF4106EBZ1
EVAL-ADF411XEBZ1
1
Z = RoHS Compliant.
1
Temperature Range
–40°C to + 85°C
–40°C to + 85°C
–40°C to + 85°C
–40°C to + 85°C
–40°C to + 85°C
–40°C to + 85°C
–40°C to + 85°C
–40°C to + 85°C
–40°C to + 85°C
–40°C to + 85°C
–40°C to + 85°C
–40°C to + 85°C
Package Description
16-Lead Thin Shrink Small Outline Package (TSSOP)
16-Lead Thin Shrink Small Outline Package (TSSOP)
16-Lead Thin Shrink Small Outline Package (TSSOP)
16-Lead Thin Shrink Small Outline Package (TSSOP)
16-Lead Thin Shrink Small Outline Package (TSSOP)
16-Lead Thin Shrink Small Outline Package (TSSOP)
20-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
20-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
20-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
20-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
20-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
20-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
Evaluation Board
Evaluation Board
Rev. C | Page 21 of 24
Package Option
RU-16
RU-16
RU-16
RU-16
RU-16
RU-16
CP-20-1
CP-20-1
CP-20-1
CP-20-1
CP-20-1
CP-20-1
ADF4106