STM32F217ZET6 STMicroelectronics, STM32F217ZET6 Datasheet - Page 156

• Manufacturer Part Number: STM32F217ZET6
• Description: MCU ARM 512KB FLASH 144LQFP
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32F217ZET6

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 120MHz
• Connectivity: CAN, Ethernet, I²C, IrDA, LIN, MMC, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
• Number Of I /o: 114
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Eeprom Size: -
• Ram Size: 132K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 24x12b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-11188

Revision history
156/158
Table 88.
22-Apr-2011
Date
Document revision history (continued)
(continued)
Revision
4
Updated
well as
mode, code with data processing running from Flash memory (ART
accelerator disabled)
consumption in Run mode, code with data processing running from
Flash memory (ART accelerator enabled) or
Figure
Updated
mode, and added
Updated
Standby mode
consumptions in VBAT
Updated
mode. Added
in Stop
Updated
Standby mode
consumptions in VBAT
Updated
Table 21: Peripheral current
Updated t
power mode wakeup
Maximum f
High-speed external user clock
Updated C and g
characteristics. Updated R
oscillator characteristics (fLSE = 32.768
Added
HSI oscillator
temperature
Updated f
characteristics.
Table 29: Main PLL
jitter, IDD
maximum values.
Table 30: PLLI2S (audio PLL)
t
minimum and maximum values.
Added
Updated
Flash memory programming
and added
Modified
Updated
in
Added
maximum
Added
Updated
frequency values and conditions in
LOCK
Section : Electromagnetic Interference
Doc ID 17050 Rev 4
, jitter, IDD
21,
Note 3
Note 1
Note 2
Section 5.3.15: I/O current injection
Table 15: Typical and maximum current consumption in Run
mode.
Table 17: Typical and maximum current consumption in Sleep
Table 18: Typical and maximum current consumptions in Stop
Typical and maximum current consumption
Table 19: Typical and maximum current consumptions in
Table 19: Typical and maximum current consumptions in
On-chip peripheral current consumption
Table 32: Flash memory
Figure 36: Recommended NRST pin
Table 37: EMI characteristics
Table 41: I/O static
(PLL)
WUSTDBY
LSI
ratings.
Figure
HSE_ext
Note 2
, t
characteristics. Added
Figure 26: Typical current consumption vs temperature
and IDD
su(LSI)
and updated ACC
in
related to V
and
and
(PLLI2S)
Table 31: SSCG parameters
m
22, and
Figure 24
and minimum t
in
in
and t
Table 20: Typical and maximum current
Table 20: Typical and maximum current
characteristics: removed note 1, updated t
and IDD
Table 34: Flash memory programming with
timings.
and
Table 25: HSE 4-26 MHz oscillator
A(PLL)
mode.
mode.
and IDD
WUSTOP
Table 16: Typical and maximum current
Figure
ESD(HBM)
F
, I
consumption.
and
characteristics. Modified maximum
, added
and added
(LSI)
2
characteristics: removed note 1, updated
, g
Changes
characteristics.
, and added
A(PLLI2S)
HSI
Figure
m
23.
w(HSE)
in
characteristics. Modified
, and t
in
Table 43: I/O AC
, IDD
Table 28: LSI oscillator
Note 2
STM32F215xx, STM32F217xx
Figure 31: ACCHSI versus
Table 38: ESD absolute
and EMI monitoring conditions
25.
values updated in
Note 2
kHz).
su(LSE)
(HSI)
, added
(EMI).
characteristics.
for f
Note 3
RAM. Added
and t
constraint.
protection.
in
for t
PLL_IN
Note 3
conditions and
Table 26: LSE
su(HSI)
prog
in
characteristics.
conditions, as
Table 22: Low-
minimum and
. Updated t
for f
in
Figure
Table 23:
Table 33:
Table 27:
PLLI2S_IN
LOCK
VPP.
20,
prog
,