EMIF02-1003M6 STMicroelectronics, EMIF02-1003M6 Datasheet
EMIF02-1003M6
Specifications of EMIF02-1003M6
EMIF02-1003M6
Related parts for EMIF02-1003M6
EMIF02-1003M6 Summary of contents
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... Computers and printers ■ Communication systems ■ MCU Boards Description The EMIF02-1003M6 line highly integrated device designed to suppress EMI/RFI noise in all systems exposed to electromagnetic interference. This filter includes ESD protection circuitry, which prevents damage to the application when subjected to ESD surges all pins. ...
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... Input capacitance per line line Symbol Test conditions per line Tolerance ± 10 MHz line R DC OSC S21 F = 900 MHz 2/ °C unless otherwise specified) amb Parameter = 25 °C) amb RM Min. EMIF02-1003M6 Value 15 8 125 - -55 to +150 Typ. Max. 5 6.5 8 100 100 30 39 -26 Unit kV ° ...
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... EMIF02-1003M6 Figure 3. S21(db) attenuation measurement ( bias dB 0.00 -5.00 -10.00 -15.00 -20.00 -25.00 F (Hz) -30.00 100.0k 1.0M 10.0M I1-O1 Figure 5. ESD response to IEC 61000-4-2 (+15 kV air discharge) on one input and on one output Figure 7. Line capacitance versus reverse voltage applied (typical value) C (pF) ...
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... Ordering information scheme EMI Filter Number of lines Information x = resistance value (Ohms capacitance value / 10(pF) Package Mx = Micro QFN x leads 4/ OUT OUT OUT GND GND GND GND GND GND OUT OUT OUT OUT 2 GND 5 GND OUT EMIF yy EMIF02-1003M6 Dat1 Dat2 Keypad Keypad - xxx z Mx ...
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... EMIF02-1003M6 4 Package information ● Epoxy meets UL94 order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label ...
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... PCB. Only pin 1 mark used for this purpose. 6/10 4.00+/-0.1 4.00+/-0.1 2.0+/-0.05 2.0+/-0.05 F 0.75 0.75 1.20 User direction of unreeling User direction of unreeling EMIF02-1003M6 φ 1.5 +/- 0.1 φ 1.5 +/- 0 4.00 4.00 ...
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... EMIF02-1003M6 5 Recommendation on PCB assembly 5.1 Stencil opening design 1. General recommendation on stencil opening design a) Stencil Opening Dimensions: L (Length), W (Width), T (Thickness). Figure 13. Stencil opening dimensions b) General Design Rule Stencil thickness ( 125 µm Aspect Ratio Aspect Area 2. Reference design a) Stencil opening thickness: 100 µm b) Stencil opening for central exposed pad: Opening to footprint ratio is 50% ...
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... Note: Minimize air convection currents in the reflow oven to avoid component movement. 8/10 3°C/s max 3°C/s max 150 sec 90 to 150 sec EMIF02-1003M6 2°C/s recommended 2°C/s recommended 6°C/s max 6°C/s max Time (min) Time (min) 10-30 sec 10-30 sec 90 sec max ...
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... EMIF02-1003M6 6 Ordering information Table 4. Ordering information Part number EMIF02-1003M6 1. The marking can be rotated by 90° to diferentiate assembly location 7 Revision history Table 5. Document revision history Date 07-Oct-2007 Marking Package (1) F Micro QFN Revision 1 Initial release. Ordering information Weight Base qty Delivery mode 2 ...
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... Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 10/10 Please Read Carefully: © 2007 STMicroelectronics - All rights reserved STMicroelectronics group of companies www.st.com EMIF02-1003M6 ...