NUF3101FCT1G ON Semiconductor, NUF3101FCT1G Datasheet
NUF3101FCT1G
Manufacturer Part Number
NUF3101FCT1G
Description
IC FILTER EMI 3LINE 8FLIPCHIP
Manufacturer
ON Semiconductor
Datasheet
1.NUF3101FCT1G.pdf
(4 pages)
Specifications of NUF3101FCT1G
Resistance (ohms)
100
Capacitance
40pF
Power (watts)
0.3W
Package / Case
8-FlipChip
Resistance In Ohms
100
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Tolerance
-
Other names
NUF3101FCT1GOSTR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NUF3101FCT1G
Manufacturer:
ON/安森美
Quantity:
20 000
NUF3101FC
Three Line EMI Filter
applications. Greater than −25 dB attenuation is obtained at
frequencies from 800 MHz to 2.2 GHz. ESD protection is provided
across all capacitors.
Features
•
•
•
•
•
•
•
Benefits
•
•
•
•
Applications
•
•
•
•
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
*For additional information on our Pb−Free strategy and soldering details, please
MAXIMUM RATINGS
© Semiconductor Components Industries, LLC, 2006
March, 2006 − Rev. 2
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
ESD Discharge
Steady−State Power per Resistor
Steady−State Power per Package
Operating Temperature Range
Storage Temperature Range
Junction Temperature
This device is a three−line EMI filter array for SIM Card wireless
Low Pass Filter Response
EMI Filtering and ESD Protection
Integration of 10 Discretes
Provides Protection for IEC61000−4−2 (Level 4)
Flip−Chip Package
Moisture Sensitivity Level 1
ESD Rating: Machine Model = C; Human Body Model = 3B
Pb−Free Package is Available*
Reduces EMI/RFI Emissions on a Data Line
Integrated Solution Offers Cost and Space Savings
Reduces Parasitic Inductances Which Offer a More “Ideal”
Integrated Solution Improves System Reliability
SIM Card
EMI Filtering and ESD Protection for Data Lines
Cell Phones
Handheld Products
♦
♦
IEC61000−4−2
8.0 kV (Contact)
15 kV (Air)
Rating
Air Discharge
Contact Discharge
(T
A
= 25°C unless otherwise noted)
Symbol
T
T
V
P
P
STG
T
OP
PP
R
T
J
−55 to +150
−40 to +85
Value
+125
100
300
8.0
15
1
Unit
mW
mW
kV
°C
°C
°C
A3
B3
C3
†For information on tape and reel specifications,
NUF3101FCT1
NUF3101FCT1G
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
8−Pin Flip−Chip
CASE 499AG
(Note: Microdot may be in either location)
FC SUFFIX
Device
C2
3101
A
Y
WW
G
ORDERING INFORMATION
A2
PIN CONFIGURATION
http://onsemi.com
A3
B3
C3
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
(Pb−Free)
Flip−Chip
Flip−Chip
Package
C2
A2
B2
Publication Order Number:
100 R
100 R
47 R
GND
B2
1
B1
C1
3000 Tape & Reel
3000 Tape & Reel
MARKING
DIAGRAM
AYWW G
Shipping†
NUF3101FC/D
3101
G
A2
B1
C1
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NUF3101FCT1G Summary of contents
Page 1
... T T −40 to +85 ° −55 to +150 °C STG T +125 °C J NUF3101FCT1 NUF3101FCT1G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 1 http://onsemi.com C2 100 100 R B2 GND MARKING ...
Page 2
ELECTRICAL CHARACTERISTICS Characteristic Maximum Reverse Working Voltage Breakdown Voltage Leakage Current Series Resistance Series Resistance Series Resistance Capacitance Cut−Off Frequency 0 −5 −10 −15 −20 −25 −30 −35 1.0E+07 45 B3− ...
Page 3
PRINTED CIRCUIT BOARD RECOMMENDATIONS Parameter PCB Pad Size Pad Shape Pad Type Solder Mask Opening Solder Stencil Thickness Stencil Aperture Solder Flux Ratio Solder Paste Type Trace Finish Trace Width − 280 − 270 − 260 − 250 − 240 ...
Page 4
... American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 4 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. ...