MCZ33880EGR2 Freescale, MCZ33880EGR2 Datasheet - Page 5

• Manufacturer Part Number: MCZ33880EGR2
• Manufacturer: Freescale

Specifications of MCZ33880EGR2

• Switch Type: High Side/Low Side
• Power Switch Family: MCZ33880
• Power Switch On Resistance: 550mOhm
• Output Current: 800mA
• Number Of Outputs: 8
• Mounting: Surface Mount
• Supply Current: 8mA
• Package Type: SOIC W
• Operating Temperature (min): -40C
• Operating Temperature Classification: Automotive
• Pin Count: 28
• Power Dissipation: 1.3W
• Lead Free Status / RoHS Status: Compliant

Table 3. Maximum Ratings
permanent damage to the device.
Analog Integrated Circuit Device Data
Freescale Semiconductor
Notes
VDD Supply Voltage
CS, DI, DO, SCLK, IN5, IN6, and EN
VPWR Supply Voltage
Drain 1 – 8
Source 1 – 8
Output Voltage Clamp Low-Side Drive
Output Voltage Clamp High-Side Drive
Output Clamp Energy
ESD Voltage
Storage Temperature
Operating Case Temperature
Operating Junction Temperature
Maximum Junction Temperature
Power Dissipation (T
Thermal Resistance, Junction-to-Ambient, 28 SOIC, Case 751F-05
Thermal Resistance, Junction-to-Ambient, 32 SOIC, Case 1324-02
Thermal Resistance, Junction-to-Thermal Ground Leads, 32 SOIC, Case 1324-02
Peak Package Reflow Temperature During Reflow
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
1.
2.
3.
4.
5.
6.
7.
8.
9.
5.0 mA ≤ I
5.0 mA ≤ I
Human Body Model
Machine Model
28 SOIC, Case 751F-05
32 SOIC, Case 1324-02
Exceeding these limits may cause malfunction or permanent damage to the device.
Configured as low-side driver with 300 mA load as current limit.
Configured as high-side driver with 300 mA load as current limit.
With outputs OFF and 10 mA of test current for low-side driver, 30 mA test current for high-side driver.
Maximum output clamp energy capability at 150
ESD1 testing is performed in accordance with the Human Body Model (C
in accordance with the Machine Model (C
Maximum power dissipation with no heatsink used.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts (i.e. MC33xxxD enter 33xxx), and review parametrics.
(2)
(3)
OUT
OUT
(6)
≤ 0.3 A
≤ 0.3 A
A
(1)
(5)
= 25
(1)
°
C)
(7)
(1)
Ratings
(4)
(4)
ELECTRICAL CHARACTERISTICS
ZAP
(8)
= 200 pF, R
,
°
(9)
C junction temperature using single non-repetitive pulse method.
MAXIMUM RATINGS
ZAP
= 0 Ω).
ZAP
= 100 pF, R
Symbol
E
V
V
T
V
T
CLAMP
R
R
R
V
V
V
PPRT
ESD1
ESD2
PWR
T
P
STG
T
–
–
–
–
θJA
θJA
DD
OC
OC
θJL
ZAP
C
J
D
= 1500 Ω), and ESD2 testing is performed
ELECTRICAL CHARACTERISTICS
-0.3 to 7.0
-0.3 to 7.0
-55 to 150
-40 to 125
-40 to 150
-40 to 150
-15 to -25
-16 to 50
-18 to 40
-28 to 40
40 to 55
Value
±2000
Note 9
±200
1.3
1.7
50
94
70
18
MAXIMUM RATINGS
°
°
Unit
V
V
V
V
V
V
V
C/W
C/W
mJ
°
°
°
°
°C
V
W
DC
DC
DC
DC
DC
DC
DC
C
C
C
C
33880
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