DNAQ20TTEBKSP KOA Speer Electronics, DNAQ20TTEBKSP Datasheet
DNAQ20TTEBKSP
Manufacturer Part Number
DNAQ20TTEBKSP
Description
Manufacturer
KOA Speer Electronics
Datasheet
1.DNAQ20TTEBKSP.pdf
(1 pages)
Specifications of DNAQ20TTEBKSP
Lead Free Status / RoHS Status
Compliant
dimensions and construction
ordering information
New Part #
applications and ratings
* One diode conducting
For further information on packaging, please refer to Appendix C.
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.
KOA Speer Electronics, Inc. • Bolivar Drive • P .O. Box 547 • Bradford, PA 16701 • USA • 814-362-5536 • Fax: 814-362-8883 • www.koaspeer.com
Designation
DNA
Part
W
0.4 to 1.2V
Forward
Molded
Resin
Voltage
L
Si
Wafer
Type
DNA
Breakdown
9.5 to 11V
Reverse
Voltage
Die
Pad
Lead
n
circuit schematic
1
Leakage
Current
p
Bonding
Wire
1uA
n= number of pins (20)
Package type symbol + number of pins
QSOP: Q20
Capacitance
2pF
features
applications
Package
Symbol
Q20
•
•
•
•
•
•
•
•
Negligible reverse recovery time
Low capacitance
Low forward voltage drop
18-channel terminator in a single package
Resolved bus impedance mismatch
Termination of data/control signals @ ≥ 66 MHz
Dynamic RAM bus termination
RISC architecture
Channel
Voltage
Clamp
±10V
Capability
Voltage
16kV
ESD
diode terminator network
application schematic
Driver
Code
Size
Q20
Temperature
Operating
-55°C to
+125°C
Range
Termination
Material
ESD
L: SnPb
L
(8.66)
.341
L
(Vp ~ Vn)
Voltage
Supply
Dimensions inches (mm)
8V
DNA
Continuous
(5.99)
.236
TEB: 13" embossed
plastic tape
Forward
Current*
W
±50mA
Positive Supply
Neg. Supply or Gnd.
Packaging
TEB
8/01/05
Receiver
(1.27)
Power
.025
Total
p
1W
153
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