BAS7004E6327XT Infineon Technologies, BAS7004E6327XT Datasheet
BAS7004E6327XT
Specifications of BAS7004E6327XT
Related parts for BAS7004E6327XT
BAS7004E6327XT Summary of contents
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Silicon Schottky Diode General-purpose diode for high-speed switching Circuit protection Voltage clamping High-level detecting and mixing BAS70-04S: For orientation in reel see package information below Pb-free (RoHS compliant) package Qualified according AEC Q101 BAS170W BAS70 BAS70-02L BAS70-02W BAS70-06 BAS70-07 BAS70-06W ...
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Type BAS170W BAS70 BAS70-02L BAS70-02W BAS70-04 BAS70-04S BAS70-04W BAS70-05 BAS70-05W BAS70-06 BAS70-06W BAS70-07 BAS70-07W Maximum Ratings 25°C, unless otherwise specified A Parameter Diode reverse voltage Forward current Non-repetitive peak surge forward current t 10ms Total power dissipation ...
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Thermal Resistance Parameter 1) Junction - soldering point BAS70, BAS70-07 BAS70-02L, BAS70-02W BAS70-04, BAS70-06 BAS70-04S/W, BAS70-06W BAS70-05 BAS70-05W BAS70-07W BAS170W Electrical Characteristics at T Parameter DC Characteristics Breakdown voltage µA (BR) Reverse current ...
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Electrical Characteristics at T Parameter AC Characteristics Diode capacitance MHz R Forward resistance mA kHz F Charge carrier life time 25°C, ...
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Diode capacitance 1MHz BAS 70W/BAS 170W 2 1.5 1.0 0.5 0 Reverse current Parameter A BAS 70W/BAS 170W ...
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Forward current BAS70, BAS70- Forward current BAS70-02W ...
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Forward current BAS70-04S/W, BAS70-06W, BAS170W Forward current BAS70-05W ...
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Forward current BAS170W Permissible Pulse Load Fmax FDC p BAS70 ...
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Permissible Pulse Load Fmax FDC p BAS70-02L 0.005 0.01 - 0.02 0.05 0.1 0.2 0 Permissible Pulse Load I ...
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Permissible Pulse Load Fmax FDC p BAS70-04, BAS70- 0.005 0.01 0.02 1 0.05 10 0.1 0.2 0 Permissible ...
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Permissible Pulse Load Fmax FDC p BAS70-04W, BAS70-06W 0.005 0.01 0.02 - 0.05 0.1 0.2 0 Permissible Pulse Load ...
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Permissible Pulse Load Fmax FDC p BAS70-05W 0.005 0.01 0.02 0.05 - 0.1 0.2 0 Permissible Pulse Load I ...
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Permissible Pulse Load Fmax FDC p BAS170W 0.005 0.01 0.02 0.05 0.1 0.2 0 ...
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Package Outline Cathode marking Foot Print Marking Layout (Example) Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø180 mm = 8.000 Pieces/Reel (2 mm Pitch) Reel ø330 mm = 10.000 Pieces/Reel Standard 4 Cathode marking Package SCD80 0.2 A ...
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Date Code marking for discrete packages with one digit (SCD80, SC79, SC75 Month ...
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Package Outline Foot Print Marking Layout (Example) Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel Cathode marking Package SOD323 +0.2 0.9 -0.1 +0.2 1.25 0 -0.1 ±0.05 2 Cathode marking 1 +0.1 0.3 -0.05 ...
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Package Outline Foot Print Marking Layout (Example) Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel Package SOT143 2.9 ±0 0.2 +0.1 0.8 -0.05 +0.1 0.4 -0.05 0.25 B ...
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Package Outline Foot Print Marking Layout (Example) Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel Pin 1 Package SOT23 2.9 ±0 +0.1 0.4 -0.05 C 0.95 1.9 0.25 B ...
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Package Outline Foot Print Marking Layout (Example) Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel Package SOT323 2 ±0.2 0.1 MAX. +0.1 3x 0.3 -0.05 0 0.65 0.65 0.2 0.6 ...
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Package Outline +0.1 0.3 -0.05 4x 0.1 Foot Print Marking Layout (Example) Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel Pin 1 Package SOT343 2 ±0.2 0.1 MAX. 1.3 0 0.15 1 ...
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Package Outline Pin 1 marking Foot Print Marking Layout (Example) Small variations in positioning of Date code, Type code and Manufacture are possible. Pin 1 marking Laser marking Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = ...
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Package Outline Top view 2 1 Cathode marking 1) Dimension applies to plated terminal Foot Print For board assembly information please refer to Infineon website "Packages" Copper Marking Layout (Example) Standard Packing Reel ø180 mm = 15.000 Pieces/Reel Reel ø330 ...
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... For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies failure of such components can reasonably be expected to cause the failure of that life-support device or system affect the safety or effectiveness of that device or system ...