BAP1321-03 NXP Semiconductors, BAP1321-03 Datasheet

Planar PIN diode in a SOD323 (SC-76) ultra small SMD plastic package

BAP1321-03

Manufacturer Part Number
BAP1321-03
Description
Planar PIN diode in a SOD323 (SC-76) ultra small SMD plastic package
Manufacturer
NXP Semiconductors
Type
Attenuator/Switchr
Datasheet

Specifications of BAP1321-03

Configuration
Single
Forward Current
100mA
Forward Voltage
1.1V
Power Dissipation
500mW
Operating Temperature Classification
Military
Package Type
SOD-323
Mounting
Surface Mount
Operating Temperature (max)
150C
Operating Temperature (min)
-65C
Pin Count
2
Applications Frequency Range
UHF/SHF
Lead Free Status / RoHS Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BAP1321-03
Manufacturer:
NXP
Quantity:
48 000
Part Number:
BAP1321-03
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Product specification
Supersedes data of 2001 May 11
DATA SHEET
BAP1321-03
Silicon PIN diode
DISCRETE SEMICONDUCTORS
2004 Feb 17

Related parts for BAP1321-03

BAP1321-03 Summary of contents

Page 1

... DATA SHEET BAP1321-03 Silicon PIN diode Product specification Supersedes data of 2001 May 11 DISCRETE SEMICONDUCTORS 2004 Feb 17 ...

Page 2

... Feb 17 PINNING Marking code: V8. The marking bar indicates the cathode. Fig.1 PACKAGE DESCRIPTION plastic surface mounted package; 2 leads  90  Product specification BAP1321-03 PIN DESCRIPTION 1 cathode 2 anode 1 2 Simplified outline (SOD323; SC-76) and symbol. CONDITIONS MIN.   ...

Page 3

... 100 mA 900 MHz 100 mA 1800 MHz 100 mA 2450 MHz F when switched from 100 ; measured 100 mA 100 MHz F PARAMETER 3 Product specification BAP1321-03 TYP. MAX. UNIT 0.95 1.1 V  100 nA  0.4 pF 0.35 0.45 pF 0.25 0.32 pF  3.4 5.0  2.4 3.6  ...

Page 4

... Feb 17 MLD591 handbook, halfpage (mA Fig.3 MLD593 handbook, halfpage (GHz) Diode zero biased and inserted in series with a 50  stripline circuit. T amb Fig.5 4 BAP1321-03 500 C d (fF) 400 300 200 100  MHz. Diode capacitance as a function of reverse voltage; typical values − ...

Page 5

... Note 1. The marking bar indicates the cathode OUTLINE VERSION IEC SOD323 2004 Feb scale 1.8 1.35 2.7 0.45 0.25 0.2 1.6 1.15 2.3 0.15 0.15 REFERENCES JEDEC JEITA SC-76 5 Product specification BAP1321- detail EUROPEAN ISSUE DATE PROJECTION SOD323 Q c 03-12-17 06-03-16 ...

Page 6

... Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. 6 Product specification BAP1321-03 DEFINITION ...

Page 7

... NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 7 Product specification BAP1321-03 ...

Page 8

... Interface, Security and Digital Processing expertise Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. ...

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