TS68882MFB/C16 E2V, TS68882MFB/C16 Datasheet - Page 8

• Manufacturer Part Number: TS68882MFB/C16
• Manufacturer: E2V

Specifications of TS68882MFB/C16

• Operating Temperature (max): 125C
• Operating Temperature Classification: Military
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Compliant

3.3.3
4. Electrical Characteristics
Table 4-1.
4.0.1
Table 4-2.
V
Notes:
8
CC
Symbol
Symbol
T
P
T
T
T
V
LEADS
= 5.0 V
V
V
V
V
I
C
DMAX
CASE
CASE
V
I
P
C
I
V
STG
TSI
OL
IN
OH
CC
CC
OL
IH
IL
IN
D
L
I
1. Test load, see
2. Capacitance is periodically sampled rather than 100% tested.
0852B–HIREL–06/07
Package
Recommended Condition of Use
DC
Parameter
Supply Voltage
Input Voltage
Max Power Dissipation
Operating Temperature
Storage Temperature
Lead Temperature
Parameter
Supply Voltage
Operating Temperature
Input High Voltage
Input Low Voltage
Input Leakage Current at 5.5V CLK, RESET, R/W, A0-A4, CS, DS, AS, SIZE
HI-Z (Off state) Input Current at 2.4V/0.4V DSACK0, DSACK1, D0-D31
Output High Voltage (IOH = -400 µA)
Output Low Voltage (IOL = 5.3 mA)
Output Low Current (VOL = GND) SENSE
Power Dissipation
Capacitance (V
Output Load Capacitance
DC Electrical Characteristics
± 10%; GND = 0 V
Absolute Maximum Ratings
The macrocircuits are packaged in hermetically sealed ceramic packages which are conform to case
outlines of MIL-STD-1835 (when defined):
The precise case outlines are described on
Unless otherwise stated, all voltages are referenced to the reference terminal (see
• 68-PIN SQ.PGA UP PAE Outline
• 68-PIN Ceramic Quad Flat Pack CQFP
Figure
IN
= 0, T
7-2.
DC
A
; Tc = -55°C to +125°C
= 25°C, f = 1 MHz)
(1)
(1)
DSACK0, DSACK1, D0-D31
DSACK0, DSACK1, D0-D31
(2)
Figure 11-1
Max 5 sec. Soldering
Test Conditions
T
CASE
M Suffix
+125°C
V Suffix
= -55°C to
and
Figure
11-2.
GND - 0.3
Min
-0.3
-0.3
-55
-40
-55
Min
4.5
-55
2.0
2.4
e2v semiconductors SAS 2007
Table
+125
+150
+270
Max
+7.0
+7.0
0.75
+85
+125
0.75
Max
V
500
130
5.5
0.8
0.5
10
20
20
CC
2-1).
TS68882
Unit
Unit
°C
°C
°C
°C
W
V
V
µA
°C
µA
µA
pF
pF
W
V
V
V
V
V