MPC855TZQ50D4 Freescale, MPC855TZQ50D4 Datasheet - Page 74

• Manufacturer Part Number: MPC855TZQ50D4
• Manufacturer: Freescale

Specifications of MPC855TZQ50D4

• Family Name: MPC8xx
• Device Core: PowerQUICC
• Device Core Size: 32b
• Frequency (max): 50MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.465/3.6V
• Operating Supply Voltage (min): 2/3.135V
• Operating Temp Range: 0C to 95C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 357
• Package Type: BGA
• Lead Free Status / RoHS Status: Not Compliant

Mechanical Data and Ordering Information
14.2
Figure 77
74
Figure 77. Mechanical Dimensions and Bottom Surface Nomenclature of the ZP PBGA Package
Mechanical Dimensions of the PBGA Package
W
M
shows the mechanical dimensions of the ZP PBGA package.
V
U
R
P
N
K
H
G
E
D
C
B
A
T
L
J
F
1
E2
2
1.
2.
3.
3
4
5
BOTTOM VIEW
Dimensions and tolerance per ASME Y14.5M, 1994.
Dimensions in millimeters.
Dimension b is the maximum solder ball diameter measured parallel
to data C.
6
7
8
9
10
D1
11
TOP VIEW
12
MPC860 PowerQUICC™ Family Hardware Specifications, Rev. 8
13
14
D2
D
15
16
17
18
19
NOTE
4X
357X
E1
18X
0.15 M C
0.3 M C
E
B
0.2
b
A
e
A B
DIM
A1
A2
A3
D1
D2
E1
E2
A
D
E
b
e
0.35 C
0.2 C
0.25 C
22.40
22.40
MILLIMETERS
MIN
0.50
0.95
0.70
0.60
A2
A3
25.00 BSC
22.86 BSC
25.00 BSC
22.86 BSC
1.27 BSC
---
A1
SIDE VIEW
22.60
22.60
A
MAX
2.05
0.70
1.35
0.90
0.90
C
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