LH7A400N0F000B3A,5 NXP Semiconductors, LH7A400N0F000B3A,5 Datasheet - Page 59

• Manufacturer Part Number: LH7A400N0F000B3A,5
• Manufacturer: NXP Semiconductors

Specifications of LH7A400N0F000B3A,5

• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Processing Unit: Microprocessor
• Operating Supply Voltage (min): 1.71V
• Operating Supply Voltage (typ): 1.8V
• Operating Supply Voltage (max): 1.89V
• Package Type: LFBGA
• Pin Count: 256
• Mounting: Surface Mount
• Rad Hardened: No
• Lead Free Status / RoHS Status: Compliant

32-Bit System-on-Chip
PACKAGE SPECIFICATIONS
Preliminary data sheet
BGA256: plastic ball grid array package; 256 balls
DIMENSIONS (mm are the original dimensions)
UNIT
mm
SOT1018-1
OUTLINE
VERSION
max
1.95
A
ball A1
index area
ball A1
index area
0.5
0.3
A
1
M
K
H
D
B
T
P
F
1.45
1.25
R
N
G
E
C
A
L
J
A
2
1
IEC
2
0.55
0.45
b
3
4
Figure 48. Package outline SOT1018-1 (BGA256)
17.2
16.8
5
D
e
6
7
15.75
14.75
D
8
JEDEC
D
e
D
1
1
1
9
10
17.2
16.8
REFERENCES
1/2 e
11
E
Rev. 01 — 16 July 2007
12
NXP Semiconductors
0
15.75
14.75
13
E
14
1
b
15
JEITA
16
e
1
scale
5
1/2 e
E
15
B
e
e
1
1
∅ w
∅ v
e
A
E
2
M
M
15
e
2
C
C
10 mm
A
0.25
v
B
A
A
0.1
w
2
A
y
1
0.15
1
y
C
PROJECTION
EUROPEAN
detail X
0.35
y
1
C
X
y
ISSUE DATE
07-07-07
07-07-07
SOT1018-1
LH7A400
59