STPCC5HEBIE STMicroelectronics, STPCC5HEBIE Datasheet - Page 61

• Manufacturer Part Number: STPCC5HEBIE
• Manufacturer: STMicroelectronics

Specifications of STPCC5HEBIE

• Operating Temperature (min): -40C
• Operating Temperature (max): 115C
• Applications: CapSense
• Processing Unit: Microprocessor
• Operating Supply Voltage (min): 2.45/3V
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 2.7/3.6V
• Package Type: BGA
• Screening Level: Industrial
• Pin Count: 388
• Mounting: Surface Mount
• Rad Hardened: No
• Lead Free Status / RoHS Status: Compliant

Board
Ambient
Case
Junction
Board
Ambient
Rca
Rjc
Rjb
Rba
Figure 5-6. Thermal Dissipation With Heatsink
Board
8.5
Rja = 9.5 °C/W
Release 1.5 - January 29, 2002
3
Junction
Ambient
6
50
Case
Board dimensions:
- 10.2 cm x 12.7 cm
- 4 layers (2 for signals, 1 GND, 1VCC)
The PBGA is centred on board
There are no other devices
1 via pad per ground ball (8-mil wire)
40% copper on signal layers
Copper thickness:
- 17µm for internal layers
- 34µm for external layers
Airflow = 0
Board temperature taken at the centre balls
Heat sink is 11.1°C/W
MECHANICAL DATA
61/93