ISP1160BD,151 NXP Semiconductors, ISP1160BD,151 Datasheet - Page 80
ISP1160BD,151
Manufacturer Part Number
ISP1160BD,151
Description
Manufacturer
NXP Semiconductors
Datasheet
1.ISP1160BD151.pdf
(87 pages)
Specifications of ISP1160BD,151
Operating Temperature (max)
85C
Operating Temperature (min)
-40C
Operating Temperature Classification
Industrial
Package Type
PQFP
Mounting
Surface Mount
Lead Free Status / RoHS Status
Compliant
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20. Package outline
Fig 43. LQFP64 (SOT314-2) package outline.
ISP1160-01_7
Product data sheet
LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT314-2
max.
1.6
A
49
64
y
48
0.20
0.05
A
1
1
e
1.45
1.35
A
2
pin 1 index
136E10
IEC
0.25
A
b
3
p
H
D
D
0.27
0.17
b
p
w
M
0.18
0.12
c
X
MS-026
JEDEC
10.1
D
9.9
16
Z D
33
(1)
Rev. 07 — 29 September 2009
REFERENCES
17
32
10.1
E
9.9
(1)
Z E
0
b
B
0.5
w
p
e
e
v
M
v
JEITA
M
scale
12.15
11.85
2.5
M
H
B
D
A
A
E
12.15
11.85
H
H
E
E
5 mm
L
1
A
0.75
0.45
L
A
p
2
A
1
0.2
v
Embedded USB host controller
0.12
w
PROJECTION
EUROPEAN
detail X
0.1
y
ISP1160/01
Z
1.45
1.05
D
© ST-ERICSSON 2009. All rights reserved.
(1)
L
Z
1.45
1.05
L
E
p
ISSUE DATE
(1)
00-01-19
03-02-25
(A )
7
0
θ
3
SOT314-2
o
o
θ
80 of 87
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