LPC47N237-MT Standard Microsystems (SMSC), LPC47N237-MT Datasheet - Page 5

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LPC47N237-MT

Manufacturer Part Number
LPC47N237-MT
Description
Manufacturer
Standard Microsystems (SMSC)
Datasheet

Specifications of LPC47N237-MT

Package Type
TQFP
Pin Count
100
Lead Free Status / RoHS Status
Compliant

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LPC47N237-MT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
LPC47N237-MT
Manufacturer:
SMSC
Quantity:
8 000
Part Number:
LPC47N237-MT
Manufacturer:
SMSC
Quantity:
20 000
Package Outline
Notes:
1.
2.
3.
4.
5.
SMSC DB – LPC47N237
Controlling Unit: millimeter.
Tolerance on the position of the leads is ± 0.04 mm maximum.
Package body dimensions D1 and E1 do not include the mold protrusion. Maximum mold protrusion is 0.25 mm.
Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
Details of pin 1 identifier are optional but must be located within the zone indicated.
ccc
A1
A2
D1
E1
R1
R2
L1
W
A
D
E
H
L
e
θ
15.80
13.90
15.80
13.90
0.05
1.35
0.09
0.45
0.17
0.08
0.08
MIN
0
~
~
~
o
0.50 Basic
NOMINAL
0.60
1.00
0.22
Table 1 – 100 Pin TQFP Package Parameters
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PRODUCT PREVIEW
Figure 2 – 100 Pin TQFP Package Outline
16.20
14.10
16.20
14.10
MAX
1.60
0.15
1.45
0.20
0.75
0.27
0.20
0.08
7
~
~
o
Page 5
Overall Package Height
Lead Frame Thickness
Lead Shoulder Radius
Lead Foot Length
Lead Foot Radius
Lead Foot Angle
Body Thickness
Lead Length
X body Size
Y body Size
Lead Width
Coplanarity
REMARKS
Lead Pitch
Standoff
X Span
Y Span
Revision 0.3 (03-30-07)

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