TSOP75438TT Vishay, TSOP75438TT Datasheet - Page 6

• Manufacturer Part Number: TSOP75438TT
• Manufacturer: Vishay

Specifications of TSOP75438TT

• Lead Free Status / RoHS Status: Supplier Unconfirmed

TSOP752.., TSOP754..
Vishay Semiconductors
PACKAGE DIMENSIONS in millimeters
ASSEMBLY INSTRUCTIONS
Reflow Soldering
• Reflow soldering must be done within 72 h while stored
• Set the furnace temperatures for pre-heating and heating
• Handling after reflow should be done only after the work
www.vishay.com
6
under a max. temperature of 30 °C, 60 % RH after
opening the dry pack envelope
in accordance with the reflow temperature profile as
shown in the diagram. Excercise extreme care to keep the
maximum temperature below 260 °C. The temperature
shown in the profile means the temperature at the device
surface. Since there is a temperature difference between
the component and the circuit board, it should be verified
that the temperature of the device is accurately being
measured
surface has been cooled off
mold residue
Drawing-No.: 6.550-5297.01-4
Issue: 3; 02.09.09
21576
Tool separation line
0.5 ± 0.1
(4x)
GND
3 x
Vs
Marking area
1.27
IR Receiver Modules for Remote
6.6 ± 0.1
(3.4)
(2.2)
6.8
2.2
1.27
(3x)
=
Out
(0.635)
3.81
GND
Control Systems
Pick and place area
(R 1.3)
mold residue
Manual Soldering
• Use a soldering iron of 25 W or less. Adjust the
• Finish soldering within 3 s
• Handle products only after the temperature has cooled off
temperature of the soldering iron below 300 °C
Not indicated tolerances ± 0.15
1.27
Proposed hole layout
(for reference only)
(1)
from component side
0.8
technical drawings
according to DIN
specifications
3 x 1.27 = 3.81
2.5
3.2
Document Number: 81806
Rev. 1.5, 05-Jul-10