KHX6400S2LLK2/3G KINGSTON TECHNOLOGY, KHX6400S2LLK2/3G Datasheet

no-image

KHX6400S2LLK2/3G

Manufacturer Part Number
KHX6400S2LLK2/3G
Description
Manufacturer
KINGSTON TECHNOLOGY
Datasheet

Specifications of KHX6400S2LLK2/3G

Main Category
DRAM Module
Sub-category
DDR2 SDRAM
Module Type
200SODIMM
Device Core Size
64b
Organization
256Mx64/128Mx64
Total Density
3GByte
Chip Density
512Mb
Maximum Clock Rate
800MHz
Operating Supply Voltage (typ)
1.8V
Number Of Elements
48
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Operating Temp Range
0C to 55C
Operating Temperature Classification
Commercial
Pin Count
200
Mounting
Socket
Lead Free Status / RoHS Status
Supplier Unconfirmed
Document No. 4805070-001.A00
DESCRIPTION:
Kingston's KHX6400S2LLK2/3G is a kit consisting of one 256M x 64-bit 2GB (2048MB) DDR2-
800 plus one 128M x 64-bit 1GB DDR2-800 1GB (1024MB) CL5 SDRAM (Synchronous DRAM)
memory modules. The 2GB module is based on sixteen 128M x 8-bit DDR2 FBGA components and
the 1GB module is based on sixteen 64M x 8-Bit FBGA components. Total kit capacity is 3GB
(3072MB). Each pair has been tested to run at DDR2 800MHz at low latency timing of 5-5-5-18 at
1.8V. The SPDs are programmed to JEDEC latency timing of 5-5-5-18 at 1.8V. Each 200-pin
SODIMM uses gold contact fingers and requires +1.8V. The electrical and mechanical specifica-
tions are as follows:
FEATURES:
PERFORMANCE:
T E C H N O L O G Y
Power supply : Vdd: 1.8V ± 0.1V, Vddq: 1.8V ± 0.1V
Double-data-rate architecture; two data transfers per clock cycle
Bidirectional data strobe(DQS)
Differential clock inputs(CK and CK)
DLL aligns DQ and DQS transition with CK transition
Programmable Read latency 5, 4, 3 (clock)
Burst Length: 4, 8 (Interleave/nibble sequential)
Programmable Burst type (sequential & interleave)
Timing Reference: 5-5-5-18 at +1.8V
Edge aligned data output, center aligned data input
Auto & Self refresh, 7.8us refresh interval (8K/64ms refresh)
Serial presence detect with EEPROM
PCB : Height 1.180” (30.00mm), double sided component
Clock Cycle Time (tCK) CL=5
Row Cycle Time (tRC)
Refresh to Active/Refresh Command Time (tRFC)
Row Active Time (tRAS)
Single Power Supply of
Power
UL Rating
Operating Temperature
Storage Temperature
3GB (2GB 256M x 64-Bit + 1GB 128M x 64-Bit)
PC2-6400 CL5 200-Pin SODIMM Kit
KHX6400S2LLK2/3G
10/13/08
2.5ns (min.) / 8ns (max.)
57.5ns (min.)
2GB = 127.5ns / 1GB = 105NS
45ns (min.) / 70,000ns (max.)
+1.8V (+/- .1V)
TBD W (operating per module)
94 V - 0
0
-55
o
C to 55
o
C to +125
o
C
o
C
Page 1

Related parts for KHX6400S2LLK2/3G

KHX6400S2LLK2/3G Summary of contents

Page 1

... PC2-6400 CL5 200-Pin SODIMM Kit DESCRIPTION: Kingston's KHX6400S2LLK2/ kit consisting of one 256M x 64-bit 2GB (2048MB) DDR2- 800 plus one 128M x 64-bit 1GB DDR2-800 1GB (1024MB) CL5 SDRAM (Synchronous DRAM) memory modules. The 2GB module is based on sixteen 128M x 8-bit DDR2 FBGA components and the 1GB module is based on sixteen 64M x 8-Bit FBGA components ...

Page 2

... All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not operate at the published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to run their computers faster than the published speed. Overclocking or modifying your system timing may result in damage to computer components. Document No. 4805070-001.A00 Kingston Technology Page 2 ...

Related keywords