5962-8751507LA QP SEMICONDUCTOR, 5962-8751507LA Datasheet - Page 2

• Manufacturer Part Number: 5962-8751507LA
• Manufacturer: QP SEMICONDUCTOR

Specifications of 5962-8751507LA

• Organization: 8Kx8
• Interface Type: Parallel
• In System Programmable: In System/External
• Access Time (max): 35ns
• Package Type: CDIP
• Reprogramming Technique: UV
• Operating Supply Voltage (typ): 5V
• Operating Supply Voltage (min): 4.5V
• Operating Supply Voltage (max): 5.5V
• Pin Count: 24
• Mounting: Through Hole
• Operating Temp Range: -55C to 125C
• Operating Temperature Classification: Military
• Lead Free Status / RoHS Status: Not Compliant

DSCC FORM 2234
APR 97
accordance with MIL-PRF-38535, appendix A.
1/ Generic numbers are listed on the Standardized Microcircuit Drawing Bulletin at the end of this document and will also be
2/ Lid shall be transparent to permit ultraviolet light erasure.
3/ Must withstand the added P
4/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
1.2 Part or Identifying Number (PIN). The complete PIN shall be as shown in the following example:
1.2.1 Device type(s). The device type(s) shall identify the circuit function as follows:
1.2.2 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835, and as follows:
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
1.4 Recommended operating conditions. 1/
Device type
listed in MIL-HDBK-103.
accordance with method 5004 of MIL-STD-883.
DEFENSE SUPPLY CENTER COLUMBUS
Drawing number
5962-87515
Outline letter
Storage temperature ...........................................................-65°C to +150°C
01
02
03
04
05
06
07
08
09
10
11
12
Voltages on any pin with respect to ground .........................-0.5 V dc to +7.0 V dc
V
Maximum power dissipation (P
Lead temperature (soldering, 10 seconds) ..........................+300°C
Thermal resistance, junction-to-case (Θ
Junction temperature (T
Case operating temperature (T
Supply voltage (V
PP
|
COLUMBUS, OHIO 43218-3990
|
|
J
K
L
3
with respect to ground...................................................-0.5 V dc to +14.0 V dc
MICROCIRCUIT DRAWING
GDIP1-T24 OR CDIP2-T24
GDFP2-F24 OR CDFP3-F24
GDIP3-T24 OR CDIP4-T24
CQCC1-N28
STANDARD
Descriptive designator
CC
)............................................................+4.5 V dc to +5.5 V dc
Generic number 1/
Device type
(see 1.2.1)
D
J
) 4/ ................................................+150°C
due to short circuit test, e.g., I
01
|
|
|
D
C
) 3/ .....................................1 W
).........................................-55°C to +125°C
JC
Case outline
)..........................MIL-STD-1835
(see 1.2.2)
|
|
|
J
Terminals
24
24
24
28
OS
8K x 8 UV EPROM
8K x 8 UV EPROM
8K x 8 UV EPROM
8K x 8 UV EPROM
8K x 8 UV EPROM
8K x 8 UV EPROM
8K x 8 UV EPROM
8K x 8 UV EPROM
8K x 8 UV EPROM
8K x 8 UV EPROM
8K x 8 UV EPROM
8K x 8 UV EPROM
.
Circuit function
SIZE
A
Lead finish
(see 1.2.3)
|
|
|
A
Package style
Dual-in-line
Flat pack
Dual-in-line
Square leadless chip carrier
REVISION LEVEL
2/
2/
2/
B
Access time
2/
45 ns
55 ns
70 ns
90 ns
45 ns
55 ns
35 ns
35 ns
45 ns
55 ns
25 ns
25 ns
SHEET
5962-87515
2