ECLAMP2465T.TCT Semtech, ECLAMP2465T.TCT Datasheet - Page 5

• Manufacturer Part Number: ECLAMP2465T.TCT
• Description: IC ESD/EMI PROT SIM SLP1713P8T
• Manufacturer: Semtech
• Series: EClamp™r

Specifications of ECLAMP2465T.TCT

• Filter Type: Signal Line
• Voltage - Rated: 5V
• Mounting Type: Surface Mount
• Termination Style: Surface Mount (SMD,SMT)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Inductance: -
• Other names: ECLAMP2465TTR

Device Connection
The EClamp2465T designed with ease of layout in
mind. The package has flow through design which
allows the designer to route the signals straight in and
out between the SIM port connector and the SIM
controller. The device is in a 8-pin SLP package.
Electrical connection is made to the 8 pins located at
the bottom of the device. A center tab serves as the
ground connection. Pin connections are noted in
Figure 1. Note that the ESD protection diodes are
located at pins 1 - 3 for the data and clock lines. This
means the device is directional. Therefore, Pins 1 - 3
must be routed to the SIM connector while pins 6 - 8
are routed to the protected IC. Pin 5 is routed to the
Vcc pin of the SIM connector. Typical layout examples
are shown in Figure 3. All path lengths should be kept
as short as possible to minimize the effects of parasitic
inductance in the board traces. The center tab should
be connected directly to the ground plane. Multiple
micro-vias are recommended in the device ground pad
as shown in Figure 2. Multiple vias in the device
ground pad will result in a lower inductive ground loop,
increasing the ESD effectiveness of the device.
PROTECTION PRODUCTS
© 2008 Semtech Corp.
Figure 3 - SIM Protection Layout Examples
5
Figure 2 - Recommended Layout Using Ground Vias
Reset to Connector
Data to Connector
CLK to Connector
Figure 1 - Pin Identification and Configuration
NC
(Top Side View)
1
4
Gnd
EClamp2465T
8
5
Data to IC
CLK to IC
Reset to IC
Vcc to Connector
PRELIMINARY
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