S71VS256RC0AHK4L0 Spansion Inc., S71VS256RC0AHK4L0 Datasheet - Page 15

• Manufacturer Part Number: S71VS256RC0AHK4L0
• Description: SPZS71VS256RC0AHK4L0 ADMUX 256+64 MCP
• Manufacturer: Spansion Inc.

Specifications of S71VS256RC0AHK4L0

• Lead Free Status / RoHS Status: Supplier Unconfirmed

April 9, 2010 S71VS_XS-R_00_08
PACKAGE
SYMBOL
SE SD
JEDEC
D x E
MD
ME
Øb
A1
A2
D1
E1
eE
eD
A
D
E
n
0.80
0.18
0.62
0.25
MIN
7.70 mm x 6.20 mm
PACKAGE
7.70 BSC
6.20 BSC
6.50 BSC
4.50 BSC
0.50 BSC
0.50 BSC
0.25 BSC
RSD 056
NOM
0.90
0.30
N/A
---
---
14
10
56
S71VS/XS-R Memory Subsystem Solutions
D a t a
Figure 4.6 RSD056—56-ball VFBGA 7.7 x 6.2 mm
MAX
1.00
0.74
0.35
---
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
S h e e t
NOTE
NOTES:
1.
2.
3.
4.
5.
6
7
8.
9
10. OUTLINE AND DIMENSIONS PER CUSTOMER REQUIREMENT.
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
ALL DIMENSIONS ARE IN MILLIMETERS.
BALL POSITION DESIGNATION PER JEP95, SECTION 4.3,
SPP-010.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULATED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
3719 \ f16-038.63 \ 1.26.9
15