TZA3023T NXP Semiconductors, TZA3023T Datasheet - Page 19

• Manufacturer Part Number: TZA3023T
• Manufacturer: NXP Semiconductors

Specifications of TZA3023T

• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 8
• Lead Free Status / RoHS Status: Not Compliant

Philips Semiconductors
BONDING PAD LOCATIONS
Note
1. All coordinates are referenced, in m, to the bottom
2002 Sep 05
DREF
GND
GND
IPhoto
GND
GND
GND
GND
OUT
OUTQ
V
V
AGC
handbook, full pagewidth
SYMBOL
CC
CC
SDH/SONET STM4/OC12
transimpedance amplifier
left-hand corner of the die.
PAD
10
11
12
13
1
2
3
4
5
6
7
8
9
Fig.23 Bonding pad plus gold plate locations of the TZA3023U/G.
COORDINATES
215
360
549
691
785
785
567
424
259
1300
95
95
95
95
x
m
IPhoto
DREF
GND
GND
x
0
y
0
1
2
3
4
1055
1055
1055
881
618
473
285
501
641
95
95
95
95
y
(1)
5
13
TZA3023U/G
455 m
6
19
1030 m
12
7
11
1300
Fig.22 Bonding pad locations of the TZA3023U.
m
IPhoto
DREF
8
x
GND
GND
0
10
y
9
0
2
4
1
3
OUTQ
OUT
MCE067
5
13
TZA3023U
725
6
m
12
1030
m
7
11
Product specification
8
10
TZA3023
9
OUTQ
OUT
MCD897