IDT92HD001DX3PRGXB1X8 IDT, Integrated Device Technology Inc, IDT92HD001DX3PRGXB1X8 Datasheet - Page 121

IDT92HD001DX3PRGXB1X8

Manufacturer Part Number
IDT92HD001DX3PRGXB1X8
Description
Manufacturer
IDT, Integrated Device Technology Inc
Datasheet

Specifications of IDT92HD001DX3PRGXB1X8

Single Supply Voltage (typ)
3.3/5V
Single Supply Voltage (min)
3.135V
Single Supply Voltage (max)
3.465/5.25V
Package Type
TQFP
Lead Free Status / RoHS Status
Compliant
9. SOLDER REFLOW PROFILE
IDT™
92HD001
2-CHANNEL HIGH DEFINITION AUDIO CODEC
Time maintained above
9.1.
Note: All temperatures refer to topside of the package, measured on the package body surface.
Time within 5
2-CHANNEL HIGH DEFINITION AUDIO CODEC
Note: These devices can be hand soldered at 360
FROM: IPC / JEDEC J-STD-020C “Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface
Mount Devices” (www.jedec.org/download).
Standard Reflow Profile Data
Peak / Classification Temperature (Tp)
Preheat
Average Ramp-Up Rate (Ts
Profile Feature
o
C of actual Peak Temperature (tp)
Time 25
Temperature Max (Ts
Temperature Min (Ts
o
C to Peak Temperature
Time (ts
Temperature (T
Ramp-Down rate
min
max
Time (t
Figure 6. Solder Reflow Profile
- ts
- Tp)
max
max
min
L
L
IDT CONFIDENTIAL
)
)
)
)
)
3
150
200
60 - 180 seconds
217
60 - 150 seconds
See “Package Classification Reflow Temperatures”
on page 122.
20 - 40 seconds
6
8 minutes max
o
C for 3 to 5 seconds.
o
o
C / second max
C / second max
121
o
o
o
C
C
C
Pb Free Assembly
92HD001
PC AUDIO
V 1.1 01/08

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