SAA7103HB-T NXP Semiconductors, SAA7103HB-T Datasheet - Page 82

• Manufacturer Part Number: SAA7103HB-T
• Description: Video ICs PC DENC WO MACROVISION LICENSE
• Manufacturer: NXP Semiconductors

Specifications of SAA7103HB-T

• Adc/dac Resolution: 10b
• Screening Level: Commercial
• Package Type: PQFP
• Pin Count: 44
• Package / Case: SOT-307
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Compliant
• Other names: SAA7103H/V4,518

Philips Semiconductors
16. Revision history
Table 114: Revision history
SAA7102_SAA7103_4
Product data sheet
Document ID
SAA7102_SAA7103_4 20060118
Modifications:
SAA7102_SAA7103_3 20040301
SAA7102_03_2
SAA7102_03_1
Release date Data sheet status
20020218
20010925
[4]
[5]
[6]
[7]
[8]
[9]
•
•
•
•
The format of this data sheet has been redesigned to comply with the new presentation and
information standard of Philips Semiconductors
Table
Table
Package outline changed from SOT472-1 to SOT700-1
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
4: pin SCL corrected from I to I(/O) and updated description
4: updated description for pin SDA
Product data sheet
Product specification -
Product specification -
Product specification -
Rev. 04 — 18 January 2006
Change notice
CPCN200505019 -
SAA7102; SAA7103
Doc. number
9397 750 11445 SAA7102_03_2
9397 750 09214 SAA7102_03_1
9397 750 08371 -
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Digital video encoder
Supersedes
SAA7102_SAA7103_3
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