SST39WF1601-90-4I-B3KE Microchip Technology, SST39WF1601-90-4I-B3KE Datasheet - Page 28

• Manufacturer Part Number: SST39WF1601-90-4I-B3KE
• Description: 1.65V To 1.95V 16Mbit Multi-Purpose Flash 48 TFBGA 6x8x1.2 Mm TRAY
• Manufacturer: Microchip Technology

Specifications of SST39WF1601-90-4I-B3KE

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 16M (1M x 16)
• Speed: 90ns
• Interface: Parallel
• Voltage - Supply: 1.65 V ~ 1.95 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-TFBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Data Sheet
PACKAGING DIAGRAMS
©2008 Silicon Storage Technology, Inc.
FIGURE 25: 48-ball Thin-Profile, Fine-pitch Ball Grid Array (TFBGA) 6mm x 8mm
FIGURE 26: 48-ball Very-Very-Thin-Profile, Fine-pitch Ball Grid Array (WFBGA) 5mm x 6mm
Note:
6
5
4
3
2
1
A1 CORNER
1. Complies with JEDEC Publication 95, MO-210, variant 'AB-1', although some dimensions may be more stringent.
2. All linear dimensions are in millimeters.
3. Coplanarity: 0.12 mm
4. Ball opening size is 0.38 mm (± 0.05 mm)
Note:
SST Package Code: B3K
SST Package Code MBQ
A B C D E F G H
SEATING PLANE
1. Although many dimensions are similar to those of JEDEC Publication 95, MO-225,
2. All linear dimensions are in millimeters.
3. Coplanarity: 0.08 mm
4. Ball opening size is 0.29 mm (± 0.05 mm)
SIDE VIEW
TOP VIEW
6
5
4
3
2
1
8.00 ± 0.20
this specific package is not registered.
A1 CORNER
SEATING PLANE
A B C D E F G H J K L
DETAIL
TOP VIEW
6.00 ± 0.08
0.35 ± 0.05
6.00 ± 0.20
1.10 ± 0.10
0.20 ± 0.06
5.00 ± 0.08
0.73 max.
0.636 nom.
0.12
28
0.08
4.00
0.80
0.50
2.50
16 Mbit Multi-Purpose Flash Plus
H G F E D C B A
BOTTOM VIEW
SST39WF1601 / SST39WF1602
BOTTOM VIEW
L K J H G F E D C B A
SIDE VIEW
5.60
0.80
5.00
A1 INDICATOR
0.50
48-tfbga-B3K-6x8-450mic-4
48-wfbga-MBQ-5x6-32mic-0
A1 CORNER
6
5
4
3
2
1
6
5
4
3
2
1
1mm
0.45 ± 0.05
(48X)
0.32 ± 0.05
(48X)
S71297-04-000
1mm
12/08