HC55121IBZ Intersil, HC55121IBZ Datasheet - Page 4

• Manufacturer Part Number: HC55121IBZ
• Manufacturer: Intersil

Specifications of HC55121IBZ

• Number Of Channels: 1
• On-hook Transmission: Yes
• Polarity Reversal: Yes
• On-chip Ring Relay Driver: Yes
• Longitudinal Balanced: 53
• Operating Supply Voltage (typ): 5V
• Operating Temp Range: -40C to 85C
• Loop Current Limit: 30mA
• Operating Temperature Classification: Industrial
• Pin Count: 28
• Mounting: Surface Mount
• Operating Current: 2.7mA
• Operating Supply Voltage (max): 5.25V
• Operating Supply Voltage (min): 4.75V
• Lead Free Status / RoHS Status: Compliant

Absolute Maximum Ratings
Temperature, Humidity
Power Supply (-40°C ≤ T
Relay Driver
Digital Inputs, Outputs (C1, C2, C3, C4, C5, SHD, GKD_LVM)
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .500V
Gate Count. . . . . . . . . . . . . . . . . . . . . . . 543 Transistors, 51 Diodes
Tipx and Ringx Terminals (-40°C ≤ T
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
Typical Operating Conditions
These represent the conditions under which the device was developed and are suggested as guidelines.
Ambient Temperature
V
V
V
1. θ
Storage Temperature Range . . . . . . . . . . . . . . . . .-65°C to 150°C
Operating Temperature Range. . . . . . . . . . . . . . . . -40°C to 110°C
Operating Junction Temperature Range . . . . . . . .-40°C to 150°C
Supply Voltage V
Supply Voltage V
Supply Voltage V
Supply Voltage V
Ring Relay Supply Voltage . . . . . . . . . . . . . . . . . . . . . . 0V to 14V
Ring Relay Current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50mA
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.4V to V
Output Voltage (SHD, GKD_LVM Not Active) . . . . . -0.4V to V
Output Current (SHD, GKD_LVM) . . . . . . . . . . . . . . . . . . . . . 5mA
Tipx or Ringx Current . . . . . . . . . . . . . . . . . . . . -100mA to 100mA
BH
BL
CC
JA
with Respect to GND
with Respect to GND
with Respect to GND
is measured with the component mounted on an evaluation PC board in free air.
HC55120, HC55121, HC55130, HC55140, HC55142, HC55143, HC55150
PARAMETER
CC
BL
BH
BH
to GND . . . . . . . . . . . . . . . . . . . .-V
to GND, Continuous . . . . . . . . . -75V to 0.4V
to GND, 10ms . . . . . . . . . . . . . . -80V to 0.4V
to GND . . . . . . . . . . . . . . . . . . . . -0.4V to 7V
A
≤ 85°C)
4
A
T
≤ 85°C)
A
= 25°C
HC55120, HC55150/1
HC55121, HC55130/1, HC55140/1,
HC55142/3
BH
to 0.4V
CC
CC
CONDITIONS
Thermal Information
Thermal Resistance (Typical, Note 1)
Continuous Power Dissipation at 85°C
Lead Temperature (Soldering 10s) . . . . . . . . . . . . . . . . . . . . . . . . 300°C
Tip and Ring Terminals
(PLCC, SOIC - Lead Tips Only)
28 Lead PLCC Package. . . . . . . . . . . . . . . . . . . . . .
28 Lead SOIC Package . . . . . . . . . . . . . . . . . . . . . .
32 Lead PLCC Package. . . . . . . . . . . . . . . . . . . . . .
28 Lead PLCC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.5W
28 Lead SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2.0W
32 Lead PLCC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.4W
Tipx or Ringx, Current, Pulse < 10ms, T
Tipx or Ringx, Current, Pulse < 1ms, T
Tipx or Ringx, Current, Pulse < 10µs, T
Tipx or Ringx, Current, Pulse < 1µs, T
Tipx or Ringx, Pulse < 250ns, T
V
4.75
MIN
-40
-58
0
BH
TYP
REP
-
-
-
-
-
> 10s
REP
REP
REP
REP
MAX
> 10s . . . . . . . . . .20A
5.25
> 10s . . . . . . . . . . .5A
70
85
> 10s . . . . . . . . .15A
-8
0
> 10s . . . . . . . . . .2A
Derate above 70°C
66.2°C/W
UNITS
June 1, 2006
52°C/W
45°C/W
FN4659.13
°C
°C
θ
V
V
V
JA
20A