TDA5051AT NXP Semiconductors, TDA5051AT Datasheet
TDA5051AT
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TDA5051AT Summary of contents
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TDA5051A Home automation modem Rev. 4 — 1 July 2010 1. General description The TDA5051A is a modem IC, specifically dedicated to ASK transmission by means of the home power supply network, at 600 baud or 1200 baud data rate. ...
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... Frequency range corresponding to the EN50065-1 band. However, the modem can operate at any lower oscillator frequency. [3] The minimum value can be improved by using an external amplifier; see application diagrams 5. Ordering information Table 2. Ordering information Type number Package Name TDA5051AT SO16 TDA5051A Product data sheet Conditions f = 8.48 MHz osc Reception mode Transmission mode ...
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... NXP Semiconductors 6. Block diagram DGND 5 1 DATA_IN 4 CLK_OUT 7 OSC1 OSCILLATOR 8 OSC2 2 DIGITAL DATA_OUT DEMODULATOR TEST1 Fig 1. Block diagram TDA5051A Product data sheet AGND V V DDA DDD modulated 6 carrier ROM D/A DAC clock 10 CONTROL LOGIC filter clock ÷ 2 DIGITAL BAND-PASS FILTER 8 PEAK ...
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... HIGH) 16 test input (HIGH in application) All information provided in this document is subject to legal disclaimers. Rev. 4 — 1 July 2010 TDA5051A Home automation modem 16 TEST1 RX_IN 13 V DDA TDA5051AT 12 AGND 11 V DDAP 10 TX_OUT 9 APGND 002aaf039 © NXP B.V. 2010. All rights reserved ...
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... NXP Semiconductors 8. Functional description Both transmission and reception stages are controlled either by the master clock of the microcontroller or by the on-chip reference oscillator connected to a crystal. This ensures the accuracy of the transmission carrier and the exact trimming of the digital filter, thus making the performance totally independent of application disturbances such as component spread, temperature, supply drift and so on ...
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... NXP Semiconductors Remark: In transmission mode, the receiving part of the circuit is not disabled and the detection of the transmitted signal is normally performed. In this mode, the gain chosen before the beginning of the transmission is stored, and the AGC is internally set to − long as DATA_IN is LOW. Then, the old gain setting is automatically restored. ...
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... NXP Semiconductors 9. Limiting values Table 4. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol osc T stg T amb T j 10. Characteristics Table 5. Characteristics ± DDD DDA amb Symbol Parameter Supply V supply voltage DD I total supply current DD(tot) I total analog + digital DD(RX/TX)(tot) ...
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... NXP Semiconductors Table 5. Characteristics …continued ± DDD DDA amb Symbol Parameter OSC1 input and OSC2 output (OSC2 only used for driving external quartz crystal; must be left open-circuit when using an external clock generator) V HIGH-level input voltage IH V LOW-level input voltage IL V HIGH-level output voltage ...
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... NXP Semiconductors Table 5. Characteristics …continued ± DDD DDA amb Symbol Parameter Reception mode V analog input signal i(rms) (RMS value level at pin RX_IN I Z RX_IN input impedance i R AGC range AGC t AGC time constant c(AGC) t demodulation delay d(dem)(su) set-up time t demodulation delay ...
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... NXP Semiconductors V o(rms) (dBV) Fig 3. dBV (RMS) Fig 4. Fig 5. TDA5051A Product data sheet 0 132.5 kHz −20 −40 −60 −80 −100 5 10 Resolution bandwidth = 9 kHz; top: 0 dBV (RMS) = 120 dBμV (RMS); marker at −5 dBV (RMS) = 115 dBμV (RMS); the CISPR16 network provides an attenuation of 6 dB, so the signal amplitude is 121 dBμ ...
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... NXP Semiconductors 11. Timing 11.1 Configuration for clock Fig 6. Fig 7. Table 6. Oscillator frequency f 6.080 MHz to 9.504 MHz Table 7. Symbol f osc f CLKOUT W(DI)(min) TDA5051A Product data sheet CLK_OUT XTAL MICROCONTROLLER For parameter description, see Table External clock CLK_OUT CLK_OUT osc MICROCONTROLLER DGND ...
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... NXP Semiconductors Table 7. Symbol t W(burst)(min) t c(AGC) t su(demod) t h(demod) (1) t (2) t (3) t Fig 8. Table don’t care Fig 9. TDA5051A Product data sheet Calculation of parameters depending on the clock frequency Parameter minimum burst time of V O(DC) AGC time constant demodulation set-up time demodulation hold time ...
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... NXP Semiconductors 11.2 Timing diagrams CLK_OUT DATA_IN TX_OUT (1) DATA_IN is an edge-sensitive input and must be HIGH before starting a transmission. Fig 10. Timing diagram during power-up in Transmission mode CLK_OUT DATA_OUT Fig 11. Timing diagram during power-up in Reception mode DATA_IN TX_OUT Fig 12. Power-down sequence in Transmission mode ...
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... NXP Semiconductors DATA_OUT Fig 13. Power-down sequence in Reception mode DATA_OUT I DD Fig 14. Power saving by dynamic control of power-down TDA5051A Product data sheet PD RX_IN t d(dem)(su) DATA_OUT delayed RX_IN t active(min) I DD(RX) I DD(PD) 0 All information provided in this document is subject to legal disclaimers. Rev. 4 — 1 July 2010 TDA5051A ...
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... NXP Semiconductors 12. Application information +5 V Fig 15. Application diagram without power line insulation TDA5051A Product data sheet 250 V (AC) T 630 mA max + 78L05 2 470 μF (16 V) 100 μ (16 V) DATA_IN 1 DATA_OUT 2 MICRO- CONTROLLER CLK_OUT OSC1 2.2 MΩ XTAL 7.3728 MHz 115.2 kHz for XTAL = 7.3728 MHz standard crystal. ...
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... NXP Semiconductors (dB) a. Gain b. Input impedance Fig 16. Gain (a) and input impedance (b) of the coupling network TDA5051A Product data sheet 20 G −20 −60 −100 (Ω 115.2 kHz μ nF Main features of the coupling network rejection > 80 dB; anti-aliasing for the digital filter > the sampling frequency ( 95 kHz to 148 ...
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... NXP Semiconductors Fig 17. Output voltage as a function of line impedance +5 V Fig 18. Application diagram with power line insulation TDA5051A Product data sheet 130 V o (dBμV) 120 110 100 1 with coupling network μ nF. 250 V (AC) T 630 mA max + 78L05 2 470 μF (16 V) 100 μF ...
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... NXP Semiconductors +5 V Fig 19. Application diagram without power line insulation, with improved sensitivity TDA5051A Product data sheet 250 V (AC) T 630 mA max + 78L05 2 470 μF (16 V) 100 μ (16 V) DATA_IN 1 DATA_OUT 2 MICRO- CONTROLLER CLK_OUT OSC1 2.2 MΩ XTAL 7.3728 MHz 115.2 kHz for XTAL = 7.3728 MHz standard crystal. ...
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... NXP Semiconductors +5 V CONTROLLER Fig 20. Application diagram with power line insulation, with improved sensitivity TDA5051A Product data sheet 250 V (AC) T 630 mA max + 78L05 2 470 μF (16 V) 100 μ (16 V) DATA_IN 1 DATA_OUT 2 MICRO- CLK_OUT OSC1 2.2 MΩ XTAL 7.3728 MHz 115.2 kHz for XTAL = 7.3728 MHz standard crystal. ...
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... NXP Semiconductors 13. Test information Fig 21. Test set-up for measuring demodulation delay OSC1 OSC1 OSC2 OSC2 (1) Square wave TTL signal 300 Hz, duty factor = 50 % for measuring signal bandwidth (2) DATA_IN + LOW for measuring total harmonic distortion (see (3) Tuned for f (4) The CISPR16 network provides a −6 dB attenuation. ...
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... NXP Semiconductors DATA_IN (1) See Fig 23. Test set-up for measuring Bit Error Rate (BER) TDA5051A Product data sheet TX_OUT 10 TDA5051A 12, AGND, DGND, APGND OSC1 OSC2 XTAL = 8.48 MHz OSC1 OSC2 7 8 RX_IN out 14 TDA5051A (to be tested) 12, AGND, DGND, APGND DATA_OUT DATA_IN DATA_OUT Figure 22 ...
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... NXP Semiconductors 14. Package outline SO16: plastic small outline package; 16 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.3 2.45 mm 2.65 0.25 0.1 2.25 0.012 0.096 inches 0.1 0.01 0.004 0.089 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors 15. Handling information All input and output pins are protected against ElectroStatic Discharge (ESD) under normal handling. When handling ensure that the appropriate precautions are taken as described in JESD625-A or equivalent standards. 16. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “ ...
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... NXP Semiconductors • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities 16.4 Reflow soldering Key characteristics in reflow soldering are: • ...
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... NXP Semiconductors Fig 25. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 17. Abbreviations Table 11. Acronym ADC AGC ASK CMOS DAC HF I NRZ RMS ROM THD TTL TDA5051A Product data sheet ...
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... NXP Semiconductors 18. Revision history Table 12. Revision history Document ID Release date TDA5051A v4 20100701 • Modifications: Figure 18 “Application diagram with power line insulation” from “Newport 76250” to “Newport/Murata 78250” • Figure 20 “Application diagram with power line insulation, with improved sensitivity (68 dBmV typ.)” ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ ...
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... NXP Semiconductors 21. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 5 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Functional description . . . . . . . . . . . . . . . . . . . 5 8.1 Transmission mode . . . . . . . . . . . . . . . . . . . . . 5 8.2 Reception mode . . . . . . . . . . . . . . . . . . . . . . . . 6 8.3 Data format . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 8 ...