ISP1102AW,115 NXP Semiconductors, ISP1102AW,115 Datasheet
ISP1102AW,115
Specifications of ISP1102AW,115
Related parts for ISP1102AW,115
ISP1102AW,115 Summary of contents
Page 1
IMPORTANT NOTICE Dear customer from August 2 2008, the wireless operations of NXP have moved to a new company, ST-NXP Wireless result, the following changes are applicable to the attached document. ● Company name - NXP ...
Page 2
ISP1102A Advanced Universal Serial Bus transceiver Rev. 01 — 15 February 2007 1. General description The ISP1102A Universal Serial Bus (USB) transceiver is fully compliant with “Universal Serial Bus Specification Rev. USB data at full-speed (12 Mbit/s). The transceiver allows ...
Page 3
... NXP Semiconductors 3. Applications I Portable electronic devices, such as: N Mobile phone N Digital still camera N Personal Digital Assistant (PDA) N Information Appliance (IA) 4. Ordering information Table 1. Ordering information Type number Package Name Description ISP1102AW HBCC16 plastic thermal enhanced bottom chip carrier; 16 terminals; body 3 5. Block diagram Fig 1 ...
Page 4
... NXP Semiconductors 6. Pinning information 6.1 Pinning Fig 2. Pin configuration HBCC16 (top view) 6.2 Pin description Table 2. Pin description [1] Symbol Pin Type OE_N 1 I RCV 2 O VP/VPO 3 I/O VM/VMO 4 I/O SUSPEND ISP1102A_1 Product data sheet OE_N 1 RCV 2 VP/VPO 3 ISP1102AW VM/VMO ...
Page 5
... NXP Semiconductors Table 2. Pin description …continued [1] Symbol Pin Type CC(IO) VBUSDET AI AI VREG3V3 CC(5V0) VPU3V3 15 - SOFTCON 16 I GND exposed - die pad [1] Symbol names with an underscore N (for example, OE_N) indicate active LOW signals. [ input output; I/O = digital input/output; AI/O = analog input/output. ...
Page 6
... NXP Semiconductors 7. Functional description 7.1 Function selection Table 3. Function selection SUSPEND OE_N DP, DM LOW LOW driving or receiving LOW HIGH receiving HIGH LOW driving [1] HIGH HIGH high-Z [1] Signal levels on the DP and DM pins are determined by other USB devices and external pull-up or pull-down resistors. ...
Page 7
... NXP Semiconductors Sharing mode — this mode, the DP and DM pins are 3-stated and the ISP1102A allows external signals 3 share the DP and DM lines. The internal circuits of the ISP1102A ensure that virtually no current (maximum drawn through the DP and DM lines. The power consumption through pin V Pins VBUSDET and RCV are driven to LOW to indicate this mode ...
Page 8
... NXP Semiconductors 7.4 Power supply input options The ISP1102A has two power supply input options. Internal regulator — Pin V used to supply the internal circuitry with 3.3 V (nominal). The VREG3V3 pin becomes a 3.3 V output reference. Regulator bypass — Pins V The internal regulator is bypassed and the internal circuitry is supplied directly from pin VREG3V3. The voltage range comply with Bus Specifi ...
Page 9
... NXP Semiconductors 8. ElectroStatic Discharge (ESD) 8.1 ESD protection For the HBCC package, the pins that are connected to the USB connector (DP, DM, V CC(5V0) is limited by the test equipment. Capacitors of 4.7 F connected from VREG3V3 to GND and V CC(5V0) HIGH VOLTAGE DC SOURCE Fig 3. Human body ESD test model 8 ...
Page 10
... NXP Semiconductors 9. Limiting values Table 9. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V supply voltage (5.0 V) CC(5V0 supply voltage CC(IO) V input voltage I I latch-up current lu V electrostatic discharge voltage pins DP, DM, V esd T storage temperature stg [1] Testing equipment limits measurement to only 12 kV. Capacitors needed on V [2] Equivalent to discharging a 100 pF capacitor through a 1 ...
Page 11
... NXP Semiconductors Table 11. Static characteristics: supply pins CC(5V0) (VREG3V3) level combinations +85 C; unless otherwise specified. amb Symbol Parameter I sharing mode supply current CC(IO)sharing on pin V CC(IO) I sharing mode load current load(sharing)DM on pin DM I sharing mode load current load(sharing)DP on pin DP V supply voltage detection CC(5V0)th threshold (5 ...
Page 12
... NXP Semiconductors Table 12. Static characteristics: digital pins CC(IO) GND Symbol Parameter Capacitance C input capacitance in Example 1.8 V 0.15 V CC(IO) Input levels V LOW-level input voltage IL V HIGH-level input voltage IH Output levels V LOW-level output voltage OL V HIGH-level output voltage OH Leakage current I input leakage current ...
Page 13
... NXP Semiconductors Table 13. Static characteristics: analog I/O pins DP and 4 5 CC(5V0) (VREG3V3) Symbol Parameter Input levels Differential receiver V differential input sensitivity DI V differential common mode CM voltage Single-ended receiver V LOW-level input voltage IL V HIGH-level input voltage IH V hysteresis voltage hys Output levels ...
Page 14
... NXP Semiconductors Table 14. Dynamic characteristics: analog I/O pins DP and 4 5 CC(5V0) (VREG3V3) level combinations +85 C; unless otherwise specified. amb Symbol Parameter V output signal crossover CRS voltage Driver timing t driver propagation PLH(drv) delay (LOW to HIGH) t driver propagation PHL(drv) delay (HIGH to LOW) ...
Page 15
... NXP Semiconductors Fig 4. Rise time and fall time 1.8 V logic 0.9 V input PZH t PZL V OH differential V CRS data lines V OL Fig 6. Timing of OE_N to DP and DM ISP1102A_1 Product data sheet 1.8 V logic input 004aaa572 Fig 5. Timing of VPO and VMO to DP and DM differential data lines 0 ...
Page 16
... NXP Semiconductors 13. Test information Fig 8. Load on pins DP and DM Fig 9. Load on pins DP and DM for enable time and disable time Fig 10. Load on pins VM/VMO, VP/VPO and RCV ISP1102A_1 Product data sheet VPU3V3 DUT DP/DM Load capacitance (minimum or maximum timing) L D.U. for t and t PZH ...
Page 17
... NXP Semiconductors 14. Package outline HBCC16: plastic thermal enhanced bottom chip carrier; 16 terminals; body 0.65 mm terminal 1 index area 1 1 DIMENSIONS (mm are the original dimensions UNIT max. 0.10 0.7 0.33 0.33 mm 0.8 0.05 0.6 0.27 0.27 OUTLINE VERSION IEC SOT639-2 Fig 11. Package outline SOT639-2 (HBCC16) ...
Page 18
... NXP Semiconductors 15. Packing information The ISP1102AW (HBCC16 package) is delivered on a Type A carrier tape, see The tape dimensions are given in The reel diameter is 330 mm. The reel is made of polystyrene (PS) and is not designed for use in a baking process. The cumulative tolerance of 10 successive sprocket holes is 0.02 mm. The camber must not exceed 100 mm ...
Page 19
... NXP Semiconductors 16.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board ...
Page 20
... NXP Semiconductors • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic) ...
Page 21
... NXP Semiconductors For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description” . 17. Abbreviations Table 18. Acronym ASIC CMOS ESD HBM SE0 USB 18. References [1] Universal Serial Bus Specification Rev. 2.0 [2] Electrostatic Discharge (ESD) Sensitivity Testing Human Body Model (HBM) (JESD22-A114D) 19 ...
Page 22
... For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail ...
Page 23
... NXP Semiconductors 22. Tables Table 1. Ordering information . . . . . . . . . . . . . . . . . . . . .2 Table 2. Pin description . . . . . . . . . . . . . . . . . . . . . . . . . .3 Table 3. Function selection . . . . . . . . . . . . . . . . . . . . . . .5 Table 4. Driving function using differential input data interface (pin OE_N = LOW Table 5. Receiving function (pin OE_N = HIGH Table 6. Pin states in sharing modes . . . . . . . . . . . . . . .6 Table 7. Power supply configuration overview . . . . . . . . .6 Table 8. ...
Page 24
... NXP Semiconductors 23. Figures Fig 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 Fig 2. Pin configuration HBCC16 (top view Fig 3. Human body ESD test model Fig 4. Rise time and fall time . . . . . . . . . . . . . . . . . . . . .14 Fig 5. Timing of VPO and VMO to DP and .14 Fig 6. Timing of OE_N to DP and .14 Fig 7. Timing of DP and DM to RCV, VP/VPO and VM/VMO ...
Page 25
... NXP Semiconductors 24. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Functional description . . . . . . . . . . . . . . . . . . . 5 7.1 Function selection 7.2 Operating functions 7.3 Power supply configurations . . . . . . . . . . . . . . . 5 7.4 Power supply input options . . . . . . . . . . . . . . . . 7 8 ElectroStatic Discharge (ESD) ...