FW82546GB Intel, FW82546GB Datasheet - Page 13

• Manufacturer Part Number: FW82546GB
• Manufacturer: Intel

Specifications of FW82546GB

• Operating Supply Voltage (typ): 1.5/2.5/3.3V
• Operating Supply Voltage (min): 1.43/2.38/3V
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 364
• Lead Free Status / RoHS Status: Not Compliant

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Datasheet
Device
Technology
Internal PLL for clock generation (use either a 25
MHz crystal or a 25 MHz oscillator)
JTAG (IEEE 1149.1) Test Access Port built in silicon
On-chip power control circuitry
Eight software definable pins
Supports little endian byte ordering for both 32 and 64
bit systems and big endian byte ordering for 64 bit
systems
Provides loopback capabilities
Single-pin LAN disable function
VLAN Management Filtering
Full 2/3 Wire Downshift capability
PICMIG 3.1 Compliant SERDES Interface
364-pin Ball Grid Array (BGA) package
Footprint compatible with the 82544GC/EI and
82545GM/EM single port gigabit Ethernet controllers
Implemented in 0.15µ CMOS process
3.3 V PCI signaling with an average power dissipation
of 3.5 W
Operating temperature: 0° C to 55° C (with or without
thermal management, maximum); 0° C to 70° C (with
increased thermal management, maximum)
Features
Features
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Lower component count and system cost
Simplified testing using boundary scan
Reduced number of on-board power supply
regulators
Simplified power supply design
Additional flexibility for LEDs or other low speed
I/O devices
Portable across application architectures
Validates silicon integrity
Allows LAN port enabling and disabling through
BIOS control (OS not required) for both ports
Allows VLAN-based management packet filtering
Allows silicon to downshift speed to two or three
wire install and still achieve valid link
Enables interface connections with PICMIG 3.1
compliant devices
21 mm x 21 mm component makes LOM designs
easier
Single port or dual port implementation on the
same board with minor option changes.
Offers lowest geometry to minimize power and
size while maintaining Intel quality reliability
standards
Lower power requirements
Extended temperature attainable with thermal
management device for more demanding systems
requiring a wider temperature range.
Networking Silicon — 82546GB
Benefits
Benefits
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