527-24AB-MS4 Wakefield Thermal Solutions, 527-24AB-MS4 Datasheet
527-24AB-MS4
Manufacturer Part Number
527-24AB-MS4
Description
HEATSINK BXB50,75,100,150.24"HRZ
Manufacturer
Wakefield Thermal Solutions
Series
527r
Datasheet
1.637-10ABP.pdf
(8 pages)
Specifications of 527-24AB-MS4
Package Cooled
Half Brick DC/DC Converter
Attachment Method
Thermal Tape, Adhesive (Included)
Outline
60.96mm x 57.91mm
Height
0.240" (6.10mm)
Power Dissipation @ Temperature Rise
5W @ 60°C
Thermal Resistance @ Forced Air Flow
5.8°C/W @ 300 LFM
Lead Free Status / RoHS Status
Lead free / RoHS non-compliant
Thermal Resistance @ Natural
-
Other names
919342
919342
BXB-HTSK-24H
BXB-HTSK-24H
919342
BXB-HTSK-24H
BXB-HTSK-24H
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527-24AB-MS4 Summary of contents
Page 1
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Page 2
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Page 3
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Page 4
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Page 5
EXTRUDED HEAT SINKS FOR POWER SEMICONDUCTORS PERFORMANCE, LOW PROFILE HEAT SINKS FOR POWER MODULES & IGBT’S ...
Page 6
EXTRUDED HEAT SINKS FOR DC/DC CONVERTERS ...
Page 7
EXTRUDED HEAT SINKS FOR DC/DC CONVERTERS ...
Page 8
EXTRUDED HEAT SINKS FOR DC/DC CONVERTERS ...