625-45AB Wakefield Thermal Solutions, 625-45AB Datasheet - Page 8

• Manufacturer Part Number: 625-45AB
• Description: HEATSINK CPU 25MM SQ H=.45" BLK
• Manufacturer: Wakefield Thermal Solutions
• Series: 625r

Specifications of 625-45AB

• Height: 0.45" (11.43mm)
• Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
• Attachment Method: Thermal Tape, Adhesive (Not Included)
• Outline: 25.00mm x 25.00mm
• Thermal Resistance @ Forced Air Flow: 15.0°C/W @ 200 LFM
• Packages Cooled: BGA / LED
• Width: 25mm
• Heat Sink Material: Aluminum
• Length: 25mm
• Mounting Type: Clip-On
• Package / Case: BGA
• Color: Black
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power Dissipation @ Temperature Rise: -
• Thermal Resistance @ Natural: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 345-1090; 62545AB

DELTEM
1 0 0
8 0
6 0
4 0
2 0
™
0
0
0
COMPOSITE HEAT SINKS FOR BGAs
200
0.25
HEAT DISSIPATED (WATTS)
AIR VELOCITY (LFM)
Available with pressure sensitive adhesives for quick and easy mounting. See Page 3
Available with pressure sensitive adhesives for quick and easy mounting. See Page 3
400
0.50
600
0.75
800
1.00
1000
1.25
3 0
2 5
2 0
1 5
1 0
5
0
1 0 0
8 0
6 0
4 0
2 0
0
0
0
200
0.25
HEAT DISSIPATED (WATTS)
AIR VELOCITY (LFM)
400
0.50
600
0.75
800
1.00
1000
1.25
1 6
1 4
1 2
1 0
8
6
4
2
0