1-5111595-1 TE Connectivity, 1-5111595-1 Datasheet - Page 2

• Manufacturer Part Number: 1-5111595-1
• Description: Conn IDC Connector M 50 POS 2.54mm IDT RA Cable Mount
• Manufacturer: TE Connectivity
• Type: IDC Connectorr
• Series: AMPMODU System 50r

Specifications of 1-5111595-1

• Pitch: 2.54 mm
• Number Of Rows: 4
• Number Of Contacts: 50
• Gender: M
• Contact Plating: Tin Over Nickel
• Termination Method: IDT
• Connector Type: Wire To Board
• Contact Termination: IDC / IDT
• No. Of Contacts: 50
• No. Of Rows: 4
• Pitch Spacing: 1.27mm
• Rohs Compliant: Yes
• Type Of Connector: Paddleboard
• Mating Connector Lock: Without
• Wire/cable Type: Ribbon Cable
• Mount Angle: Vertical
• Pcb Mount Retention: Without
• Cover Material: Polyester
• Voltage (vac): 30
• Insulation Resistance (m?): 5,000
• Contact - Rated Current (a): 0.5
• Termination Post Length (mm [in]): 2.54 [0.100]
• Number Of Positions: 50
• Ribbon Cable Centerline Spacing (mm [in]): 0.64 [0.025]
• Contact Termination Type: Through Hole
• Contact Base Material: Copper Alloy
• Contact Plating, Mating Area, Material: Tin
• Housing Material: Liquid Crystal Polymer (LCP)
• Ul Flammability Rating: UL 94V-0
• Housing Color: Black
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C
• Rohs/elv Compliance History: Always was RoHS compliant
• Applies To: Printed Circuit Board
• Temperature Range (°c): -65 – +105

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Catalog 1307819
Revised 8-08
www.tycoelectronics.com
Product Facts
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High density; contacts
spaced on .050 x .100
[1.27 x 2.54] centers
Single row; select sizes 4
thru 50 positions
Double row; select sizes 10
thru 100 positions
Stand-offs for ease of
cleaning
High temperature tolerant
thermoplastic housings
Shrouded and unshrouded
headers available in single
and double row, vertical
and right-angle
configurations
are metric equivalents.
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
AMPMODU Interconnection System
Thru-Hole Headers––Shrouded, .050 x .100 [1.27 x 2.54] Centerline,
Board-to-Board
The AMPMODU System 50
interconnection system is
designed to better meet
industry’s need for a high
density interconnect
system. The Board
Mounted Thru-Hole
Headers are available in
shrouded and unshrouded
versions. They are
composed of single and
double row post headers
with .050 x .100
[1.27 x 2.54] spacing
between contacts for
extreme density and
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
efficient use of printed
circuit board area. The
headers are available in
4 through 50 positions, in
a single row configuration,
and 10 through 100
positions, in a double row
design.
Board mounted post
headers are available in
right-angle and vertical
configurations. Shrouded
post headers provide
polarization and alignment
features for mating printed
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
circuit boards and cable
connectors, while
unshrouded headers allow
close stacking of daughter
cards. Housings for the
headers are made of black
thermoplastic material with
a 94V-0 rating. The
housings have stand-offs
for free drainage of flux
cleaning solutions.
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208