PBHV8115Z,115 NXP Semiconductors, PBHV8115Z,115 Datasheet
PBHV8115Z,115
Specifications of PBHV8115Z,115
PBHV8115Z T/R
PBHV8115Z T/R
Related parts for PBHV8115Z,115
PBHV8115Z,115 Summary of contents
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PBHV8115Z 150 NPN high-voltage low V Rev. 02 — 9 December 2008 1. Product profile 1.1 General description NPN high-voltage low V power SOT223 (SC-73) Surface-Mounted Device (SMD) plastic package. PNP complement: PBHV9115Z. 1.2 Features I High ...
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... NXP Semiconductors 2. Pinning information Table 2. Pin Ordering information Table 3. Type number PBHV8115Z 4. Marking Table 4. Type number PBHV8115Z PBHV8115Z_2 Product data sheet 150 NPN high-voltage low V Pinning Description base collector emitter collector Ordering information Package Name Description SC-73 plastic surface-mounted package with increased heatsink ...
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... NXP Semiconductors 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol V CBO V CEO V EBO tot amb T stg [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for collector 6 cm ...
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... NXP Semiconductors 6. Thermal characteristics Table 6. Symbol R th(j-a) R th(j-sp) [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for collector th(j-a) (K/W) duty cycle = 1 2 0.75 10 0.5 0.33 0.2 ...
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... NXP Semiconductors 7. Characteristics Table unless otherwise specified. amb Symbol I CBO I CES I EBO CEsat V BEsat off [1] Pulse test: t PBHV8115Z_2 Product data sheet 150 NPN high-voltage low V Characteristics Parameter Conditions collector-base cut-off V = 120 current V = 120 150 C j collector-emitter cut-off V = 120 current emitter-base cut-off ...
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... NXP Semiconductors 500 h FE 400 (1) 300 (2) 200 (3) 100 ( 100 C amb ( amb ( amb Fig 4. DC current gain as a function of collector current; typical values 1 (V) (1) 0.8 (2) ( amb ( amb ( 100 C amb Fig 6. Base-emitter voltage as a function of collector current; typical values PBHV8115Z_2 Product data sheet ...
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... NXP Semiconductors 1 V CEsat ( ( 100 C amb ( amb ( amb Fig 8. Collector-emitter saturation voltage as a function of collector current; typical values CEsat ( ) ( 100 C amb ( amb ( amb Fig 10. Collector-emitter saturation resistance as a function of collector current; typical values PBHV8115Z_2 Product data sheet 150 NPN high-voltage low V ...
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... NXP Semiconductors 8. Test information Fig 12. Test circuit for switching times 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors , and is suitable for use in automotive applications. ...
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... NXP Semiconductors 11. Soldering 1.3 1 Fig 14. Reflow soldering footprint SOT223 (SC-73) 1.9 Fig 15. Wave soldering footprint SOT223 (SC-73) PBHV8115Z_2 Product data sheet 150 NPN high-voltage low V 7 3.85 3.6 3.5 0 2.3 2 6.15 8.9 6 2.7 2.7 1.9 1 Rev. 02 — ...
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... NXP Semiconductors 12. Revision history Table 9. Revision history Document ID Release date PBHV8115Z_2 20081209 • Modifications: Table • Figure • Section 13 “Legal PBHV8115Z_1 20080205 PBHV8115Z_2 Product data sheet 150 NPN high-voltage low V Data sheet status Product data sheet 5: I maximum value changed from 100 mA to 400 mA ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 15. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 8 8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 8 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 10 Packing information Soldering ...