LE79R70-1DJC Zarlink, LE79R70-1DJC Datasheet - Page 6

• Manufacturer Part Number: LE79R70-1DJC
• Description: SLIC 1-CH 40dB 110mA 5V 32-Pin PLCC Tube
• Manufacturer: Zarlink

Specifications of LE79R70-1DJC

• Package: 32PLCC
• Number Of Channels Per Chip: 1
• Polarity Reversal: Yes
• Longitudinal Balanced: 40(Min) dB
• Loop Current: 110 mA
• Minimum Operating Supply Voltage: 4.75 V
• Typical Operating Supply Voltage: 5 V
• Typical Supply Current: 6.5 mA

ABSOLUTE MAXIMUM RATINGS
Stresses above those listed under Absolute Maximum Ratings can cause permanent device failure. Functionality at or above
these limits is not implied. Exposure to absolute maximum ratings for extended periods may affect device reliability.
Note:
1.
2.
Package Assembly
Green package devices are assembled with enhanced, environmental compatible lead-free, halogen-free, and antimony-free
materials. The leads possess a matte-tin plating which is compatible with conventional board assembly processes or newer lead-
free board assembly processes. The peak soldering temperature should not exceed 245°C during printed circuit board assembly.
Refer to IPC/JEDEC J-Std-020B Table 5-2 for the recommended solder reflow temperature profile.
OPERATING RANGES
Environmental Ranges
Zarlink guarantees the performance of this device over the commercial (0º C to 70º C) temperature range by conducting
electrical characterization and by conducting a production test with single insertion coupled to periodic sampling. These
characterization and test procedures comply with section 4.6.2 of Bellcore GR-357-CORE Component Reliability Assurance
Requirements for Telecommunications Equipment.
Thermal limiting circuitry on the chip will shut down the circuit at a junction temperature of about 165ºC. Continuous operation above 145ºC
junction temperature may degrade device reliability.
The thermal performance of a thermally enhanced package is assured through optimized printed circuit board layout. Specified performance
requires that the exposed thermal pad be soldered to an equally sized exposed copper surface, which, in turn, conducts heat through
multiple vias to a large internal copper plane.
Storage temperature
Ambient temperature under bias
V
V
V
V
BGND with respect to AGND/DGND
A (TIP) or B (RING) to BGND:
Current from A (TIP) or B (RING)
RYOUT1, RYOUT2 current
RYOUT1, RYOUT2 voltage
RYOUT1, RYOUT2 transient
RYE voltage
C3-C1, D2-D1, E1, B2EN and RINGIN:
Maximum continuous power dissipation, TA = 70° C
Thermal Data:
ESD Immunity (Human Body Model)
CC
NEG
BAT2
BAT1
with respect to AGND/DGND
Continuous
10 ms
Continuous
10 ms (F = 0.1 Hz)
1 µs (F = 0.1 Hz)
250 ns (F = 0.1 Hz)
Input voltage
In 32-pin PLCC package
In 32-pin QFN package
In 32-pin PLCC package
In 32-pin QFN package
with respect to AGND/DGND
with respect to AGND/DGND:
2
Zarlink Semiconductor Inc.
6
1
:
–55 to +150°C
0 to +70°C
0.4 to + 7 V
0.4 V to V
V
+0.4 to -80 V
+0.4 to -85 V
+3 to -3 V
V
V
V
V
± 150 mA
75 mA
RYE to +7 V
RYE to +10 V
BGND to V
-0.4 V to V
1.67 W
3.00 W
θ
45° C/W
25° C/W
JESD22 Class 1C compliant
JA
BAT2
BAT1
BAT1
BAT1
BAT1
to GND
– 5 V+ 1 V
– 10 V+ 5 V
– 15 V+ 8 V
– 20 V+ 12 V
BAT2
CC
BAT1
+ 0.4 V