TGA4811 TriQuint, TGA4811 Datasheet - Page 10

RF Amplifier DC - 60GHz LNA Gain Block

TGA4811

Manufacturer Part Number
TGA4811
Description
RF Amplifier DC - 60GHz LNA Gain Block
Manufacturer
TriQuint
Type
Low Noise Amplifierr
Datasheet

Specifications of TGA4811

Operating Frequency
60 GHz
P1db
13 dBm
Noise Figure
3 dB
Operating Supply Voltage
6.5 V
Supply Current
200 mA
Maximum Power Dissipation
0.69 W
Package / Case
1.3 mm x 1.06 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
1022236

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TGA4811
Manufacturer:
Microsemi
Quantity:
1 400
Reflow process assembly notes:
Component placement and adhesive attachment assembly notes:
Interconnect process assembly notes:
TriQuint Semiconductor Texas www.triquint.com Phone: (972)994 8465 Fax: (972)994 8504 info-mmw@tqs.com
Use epoxy with limited exposure to temperatures at 175
No fluxes should be utilized.
Coefficient of thermal expansion matching is critical for long-term reliability.
Devices must be stored in a dry nitrogen atmosphere.
Vacuum pencils and/or vacuum collets are the preferred method of pick up.
Air bridges must be avoided during placement.
The force impact is critical during auto placement.
Organic attachment can be used in low-power applications.
Curing should be done in a convection oven; proper exhaust is a safety concern.
Microwave or radiant curing should not be used because of differential heating.
Coefficient of thermal expansion matching is critical.
Thermosonic ball bonding is the preferred interconnect technique.
Force, time, and ultrasonics are critical parameters.
Aluminum wire should not be used.
Maximum stage temperature is 175
Assembly Process Notes
o
C.
o
C.
TGA4811
May
2006
10

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