MAX2044ETP+T Maxim Integrated Products, MAX2044ETP+T Datasheet - Page 2

• Manufacturer Part Number: MAX2044ETP+T
• Description: RF Mixer Mixer Mixer
• Manufacturer: Maxim Integrated Products

Specifications of MAX2044ETP+T

• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

V
IF+, IF-, LOBIAS to GND .......................... -0.3V to (V
RF, LO Input Power ....................................................... +20dBm
RF, LO Current (RF and LO is DC shorted
Continuous Power Dissipation (Note 1) .................................5W
B
SiGe, High-Linearity, 2300MHz to 4000MHz
Upconversion/Downconversion Mixer with LO Buffer
ABSOLUTE MAXIMUM RATINGS
Note 1: Based on junction temperature T
Note 2: Junction temperature T
Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
Note 4: T
5.0V SUPPLY DC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit, V
values are at V
3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS
(Typical Application Circuit, V
values are at V
RECOMMENDED AC OPERATING CONDITIONS
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
2
Supply Voltage
Supply Current
Supply Voltage
Supply Current
RF Frequency Range
LO Frequency
IF Frequency
LO Drive
JA
CC
to GND through a balun)................................... .............50mA
______________________________________________________________________________________
(Notes 2, 3) ............................................................ +38NC/W
to GND ..........................................................-0.3V to +5.5V
exposed pad is known while the device is soldered down to a PCB. See the Applications Information section for details.
The junction temperature must not exceed +150NC.
known. The junction temperature must not exceed +150NC.
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
C
PARAMETER
PARAMETER
PARAMETER
is the temperature on the exposed pad of the package. T
CC
CC
= 5.0V, T
= 3.3V, T
C
C
CC
= +25NC, all parameters are production tested.)
= +25NC, parameters are guaranteed by design, unless otherwise noted.)
CC
J
= 4.75V to 5.25V, no input RF or LO signals. T
= 3.0V to 3.6V, no input RF or LO signals. T
= T
SYMBOL
SYMBOL
SYMBOL
A
+ (B
V
P
I
V
f
f
I
CC
f
RF
LO
CC
CC
LO
IF
CC
J
JA
= T
x V
C
Total supply current, V
Typical Application Circuit with C1 = 3.3nH
and C12 = 0.3pF, see Table 1 for details
(Note 5)
Typical Application Circuit with C1 = 8.2pF
and C12 not installed, see Table 1 for
details (Note 5)
(Note 5)
Using an M/A-Com MABAES0029 1:1
transformer as defined in the Typical
Application Circuit, IF matching
components affect the IF frequency range
(Note 5)
(Note 5)
+ (B
CC
CC
x I
JC
CC
+ 0.3V)
x V
). This formula can be used when the ambient temperature of the PCB is
CC
x I
CONDITIONS
CONDITIONS
CONDITIONS
CC
). This formula can be used when the temperature of the
B
Operating Case Temperature
Junction Temperature .....................................................+150NC
Storage Temperature Range ............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
JC
A
CC
Range (Note 4) ..................................... T
is the ambient temperature of the device and PCB.
(Notes 1, 3) ............................................................ +13NC/W
= 3.3V
C
C
= -40NC to +85NC, unless otherwise noted. Typical
= -40NC to +85NC, unless otherwise noted. Typical
2300
3000
2600
MIN
4.75
MIN
MIN
3.0
50
-3
TYP
TYP
TYP
138
121
5.0
3.3
0
C
= -40NC to +85NC
MAX
MAX
MAX
3000
4000
4300
5.25
155
135
500
3.6
+3
UNITS
UNITS
UNITS
MHz
MHz
MHz
dBm
mA
mA
V
V